Avnet Qseven MSC Q7-BT - Thermal Management; Power Management; Use Conditions

MSC Q7-BT MSC_Q7-BT_User_Manual.pdf 23 / 113
Figure 2-2 Measurement points for the thermal probe
The stabilized temperature measured on the heat spreader and the module PCB during runtime mostly depends on the computing power demand
from the application and the cooling solution implemented in the system. It is the responsibility of the system designer to provide a cooling solution in
addition to the heat spreader that fulfils the requirements of the application.
Typically the value for Ths will be appx 5°C lower than Tpcb at max temp. The temperature at the defined point on the PCB shall not exceed the
temperature range in the following table.
NOTE: See also the BIOS setting for memory when using the system at elevated temperatures
Table 2-1 Temperature Range
Module Variant
Tpcb_min
Tpcb_max
Module variants with commercial temperature components
0°C
+70°C
Module variants with extended temperature components
-25°C
+85°C
Module variants with industrial temperature components
-40°C
+85°C