Siemens SIMATIC ET 200SP System Manual

System overview
3.4 Components
Distributed I/O system
24 System Manual, 09/2019, A5E03576849-AJ
3.4 Components
Basic components of the ET 200SP distributed I/O system
Table 3- 2 Basic components of the ET 200SP
Basic component
Function
Figure
Mounting rail in accord-
ance with EN 60715
The mounting rail is the rack of the ET 200SP.
The ET 200SP is installed on the mounting rail.
The mounting rail is 35 mm high.
CPU/Fail-safe CPU The (F) CPU:
• Runs the user program. The F-CPU also
runs the safety program.
• Can be used as an IO controller or I-Device
on PROFINET IO or as a standalone CPU
• Links the ET 200SP to the IO devices or the
IO controller
• Exchanges data with the I/O modules via the
backplane bus.
Additional CPU functions:
• Communication via PROFIBUS DP (the CPU
can be used as a DP master or DP slave in
combination with the CM DP communication
module)
• Integrated Web server
• Integrated technology
• Integrated trace functionality
• Integrated system diagnostics
• Integrated safety
• Safety mode (when using fail-safe CPUs)

Siemens SIMATIC ET 200SP Specifications

General

System Type	Distributed I/O System
Mounting	DIN Rail
Communication Protocol	PROFINET, PROFIBUS
IP Rating	IP20
Category	I/O Systems
Supply Voltage	24 V DC
Modularity	Yes
Hot Swapping	Yes
Storage Temperature	-40°C to +70°C
Digital Inputs	Yes
Digital Outputs	Yes
Analog Inputs	Yes
Analog Outputs	Yes
Communication Interface	PROFINET, PROFIBUS
Number of Modules	Up to 64
Relative Humidity	5 to 95% (non-condensing)
Operating Temperature	-25°C to +60°C