DDC Total-AceXtreme MIL-STD-1553 - Page 20

OVERVIEW
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Table 1. Total-AceXtreme® Series Specifications
PARAMETER MIN TYP MAX UNITS
1553 MESSAGE TIMING
BC Intermessage Gap (Note 7) 10 µs
BC/RT/MT No-Response Timeout – mid-parity-to-mid-sync
programmable range (Note 8)
4 511.5 µs
RT Response Time (mid-parity to mid-sync) 4 — 7 µs
Transmitter Watchdog Timeout — 660.5 — µs
THERMAL
TOTAL-ACEXTREME BGA 324-BALL BGA PACKAGE
(See Thermal Management Section)
Active Transceiver
• Junction Temperature (T
J
)
• Junction-to-Ambient (θJA via simulation)
150 °C
- Per JESD 51-2 standard at 25°C
θ
JA
in Still Air
— 68.8 — °C/W
THERMAL (Con’t)
- Per JESD 51-6 standard at 25°C
θ
JA
@ 1M/S
— 52.9 — °C/W
θ
JA
@ 2M/S
— 47.1 — °C/W
θ
JA
@ 3M/S
— 43.6 — °C/W
• Junction-to-case (θ
JC
via simulation)
- Per JESD 51-12 standard at 25°C
θ
JC
— 24.5 — °C/W
• Junction-to-board (θ
JB
via simulation)
- Per JESD 51-8
θ
JB
— 46.9 — °C/W
ALL PACKAGES
Operating Case Temperature
- EXX -40 — +100 °C
- 1XX (Note 11) -55 — +125 °C
Operating Junction Temperature
- Transceiver -55 — +150 °C
- Protocol -55 — +135 °C
Storage Temperature -65 — +150 °C
SOLDERING
324-BALL BGA PACKAGE
The reflow profile detailed in IPC/JEDEC J-STD-020 is applicable for both the leaded and lead-free versions of Total-
AceXtreme.