LPKF ProtoMat S64 - Special Tasks and Procedures

Operating the system
ProtoMat S64/S104
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LPKF Laser & Electronics AG | V. 1.0
6.4 Special tasks
This chapter describes tasks that are not part of the typical production process.
The following tasks are described:
 Inserting the cleaning device
 Measuring the thickness of the copper layer (S104 only)
 Measuring the thickness of the material
 Applying solder paste to the PCB
 Inserting the cleaning device
1. In the system software, make sure that you are logged in as Advanced user.
2. Move the processing head to the Pause position.
3. Execute one of the following steps:
 Insert the cleaning device into a free tool holder position on the processing
table.
 If there is no free position available, remove one tool holder. Use the wrench
Torx 10 that is provided in the scope of delivery.
4. Tighten the screw of the cleaning device with the wrench Torx 10.
 The cleaning device is inserted.
Fig. 92: Cleaning device inserted
5. In the system software click on Edit > Tool magazine.