Table 29. Thermal Restriction Matrix(continued)
CPU (W) Heat sink
type
Fan Type 8 x 2.5-inch SAS/SATA/NVMe or 16 x E3.s
ASHRAE A2 (Max 35° C)
(350W)
Intel SPR 32C
6448Y CPU
(225W)
Intel SPR 24C
6442Y CPU
(225W)
Intel SPR 36C
8452Y CPU
(300W)
Intel SPR 32C
8462Y+ CPU
(300W)
Intel SPR 40C
8460Y+ CPU
(300W)
Table 30. GPU/FPGA Thermal Restriction Matrix
TDP (W) Heat sink
type
Fan Type 8 x 2.5-inch SAS/SATA/NVMe or 16 x E3.s
ASHRAE A2 (Max 35° C)
Nvidia Delta
Board
(8x A100 500
W)
4U GPU
HSK+NVLink
HSK
High
Performanc
e Gold Fan
(GPU Fan)
Supported
Nvidia Delta-
Next Board
(8x H100 700
W)
NA
NOTE: When the GPUs are installed, the iDRAC sets the thermal warning threshold to 38° C
NOTE: If System Board Inlet Temp reaches 38° C, a warning message is logged. It is possible the GPUs may lower power
consumption to avoid thermal damage. This results in lower GPU performance.
Table 31. Processor and heat sink matrix
Heatsink Processor TDP
2U HPR HSK Supports all TDP
● All configurations support 35°C without any performance degradation.
● ASHRAE A3/A4 environments are not supported.
● The GPU fan service time should be limited to 30 seconds.
● Install an HDD blank if the slot is not equipped with an HDD.
● DIMM blank is not required when the DIMM population quantity is 16 pieces or more.
34
Technical specifications
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