Dell PowerEdge XE9680 - Thermal restriction matrix

Table 27. Particulate contamination specifications 
Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO
14644-1 with a 95% upper confidence limit.
NOTE: This condition applies to data center environments
only. Air filtration requirements do not apply to IT
equipment designed to be used outside a data center, in
environments such as an office or factory floor.
NOTE: Air entering the data center must have MERV11 or
MERV13 filtration.
NOTE: Air filtering can also be accomplished by filtering
room air with MERV8 filter per ANSI/ASHRAE Standard
127
Conductive dust Air must be free of conductive dust, zinc whiskers, or other
conductive particles.
NOTE: This condition applies to data center and non-data
center environments.
NOTE: Common sources of conductive dust include
manufacturing processes, and zinc whiskers from the
plating on the bottom of raised floor tiles
Corrosive dust
● Air must be free of corrosive dust.
● Residual dust present in the air must have a deliquescent
point less than 60% relative humidity.
NOTE: This condition applies to data center and non-data
center environments.
Table 28. Gaseous contamination specifications 
Gaseous contamination Specifications
Copper Coupon Corrosion rate <300 Å/month per Class G1 as defined by ANSI/
ISA71.04-2013
Silver Coupon Corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013
NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.
Thermal restriction matrix
Table 29.
Thermal Restriction Matrix
CPU (W) Heat sink
type
Fan Type 8 x 2.5-inch SAS/SATA/NVMe or 16 x E3.s
ASHRAE A2 (Max 35° C)
Intel SPR 56C
8480+ CPU
(350W)
2U CPU
HPR HSK
High
Performanc
e Gold Fan
(CPU Fan)
Supported
Intel SPR 52C
8470 CPU
(350W)
Intel SPR 48C
8468 CPU
Technical specifications 33