ACCOMPLISHING THE REFLOW PROCESS
Inspection before Reflow
11-116 Bravo™ 8105 Programming and Operations Guide Rev. 2
11
Inspection before Reflow
After Printing It is helpful to have a sample of a known good board or photographs of an ideal
production board to assist in inspection.
Solder paste print fine pitch should show the paste aligned with all pads. Solder
paste should conform to the size of pad aperture in the stencil. The surface of the
solder paste should be smooth and flat. It may be considered acceptable if the
solder paste is slightly misaligned but covers more than 50% of the solder pad
surface. If less than 50% of the pad is covered, it is unacceptable for processing.
Chip solder paste print deposit should be similar to the fine pitch, however if less
than 75% of the pad is covered, it is unacceptable.
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