Fujitsu Primergy RX300 S3 User Manual

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PRIMERGY RX300 S3 User's Guide
7
Installing Internal Options
7.4 Installing Memory Modules
Additional memory modules will help increase the amount of data that can be read at
a time and improve the server processing capability.
• Before installing or removing memory modules, turn off the server and all
peripheral devices. Also unplug all power cables from the server. Failure to do
so may cause electric shock ("1.4.3 Turning Off the Server" (pg.33)).
• Do not install unauthorized third party memory modules. Doing so may cause
electric shock, a fire, or failures.
• Wait for a sufficient period of time after server shutdown before installing or
removing memory modules. Failure to do so may cause burns.
injury
• When installing or removing memory modules, make sure to remove the
screws at the specified points only. Failure to do so may cause injury. It may
also cause failures.
• Touch only the specified part of the printed circuit board.
Failure to do so may cause injury. It may also cause failures.
• A memory module consists of parts that are very vulnerable to damage by
static electricity, and can easily be damaged by static electricity in the human
body. Before handling memory modules, first touch a metal part of the server to
discharge static electricity.
• Do not insert and remove memory modules repeatedly. Doing so may cause
failures.

Fujitsu Primergy RX300 S3 Specifications

General

Tcase	78 °C
Bus type	FSB
FSB Parity	Yes
Processor cache	4 MB
Processor cores	2
Processor model	5080
Processor series	Intel Xeon 5000 Series
Processor socket	LGA 771 (Socket J)
Processor threads	4
Processor codename	Dempsey
Motherboard chipset	Intel® 5000P
Processing Die size	162 mm²
Processor frequency	3.73 GHz
Processor cache type	L2
Processor lithography	65 nm
Processor system type	DP
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	1066 MHz
Processor operating modes	64-bit
ECC supported by processor	No
Thermal Design Power (TDP)	130 W
Processor core voltage (AC)	1.25 - 1.40 V
CPU multiplier (bus/core ratio)	14
Number of Processing Die Transistors	376 M
Maximum graphics card memory	8 MB
Memory slots	8
Internal memory	2 GB
Internal memory type	DDR2-SDRAM
Maximum internal memory	32 GB
Memory layout (slots x size)	2 x 1 GB
Networking features	Ethernet/Fast Ethernet/Gigabit Ethernet
Expansion slots	1 x PCIe x8, 2 x PCIe x4, 2 x PCI-X
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Noise level	56 dB
Chassis type	Rack (2U)
Compatible operating systems	Windows Server 2003, Novell SUSE Linux Enterprise Server, Red Hat Enterprise Linux, VMware ESX
I/O ports	8 x SAS
Power supply	600 W
Power requirements	100 - 240V, 50/60 Hz
Operating temperature (T-T)	10 - 35 °C
Safety	IEC 60950-1, EN 60950-1
Electromagnetic compatibility	EN 55 022 A, EN 55024, EN 61000-3-2 / -3-3
RAID levels	1, 5, 10, 50
Processor ARK ID	27213

Weight and Dimensions

Depth	785 mm
Width	483 mm
Height	86 mm
Weight	25000 g