Technical Data
21
5 Technical Data
5.1 Mechanical Design
Structure of the compact devices H41q
1 subrack 482.6 mm (19-inches technology), 5 HU for central modules and I/O modules
Modules in the I/O area: 4 or 8 SU, 3 HU,
max. 13 I/O modules with width 4 SU
Structure of the modular devices H51q
subracks 482.6 mm (19-inches technology), 1 central subrack 5 HU,
max. 16 I/O subracks 4 HU
Modules in the central area: width 4 and 8 SU, 3 HU,
Modules in the I/O area: width 4 or 8 SU, 3 HU,
max. 256 I/O modules with width 4 SU
Explanation:1 SU (spacing unit) = 5.08 mm (= 1 TE)
1 HU (height unit) = 44.45 mm (= 1 HE)
The connection of the external signal cables is made at the front plate of the I/O modules via
cable plugs with LED displays (no LEDs for analog modules).
For the wiring fire-retardant wires and cables are used.
5.2 System Data
Operating voltages 24 VDC (peripherals)
5 VDC (microprocessor system)
Supply voltage 24 VDC / -15 %...+20 %, r
pp
≤ 15 %
Ambient conditions 0...+60 °C, according to IEC 61131-2
pollution degree II according to DIN VDE 0160
Storage temperature -40...+85 °C (without batteries)
-40...+75 °C (central module and central subrack
with battery)
5.3 Data of the Central Module (CU)
Type of processor INTEL 386 EX
Clock frequency 25 MHz
Program memory Flash-EPROM for operating system
and function blocks
Flash-EPROM for user program
CMOS-RAM for variables
Battery backup for Lithium battery on the central module
CMOS-RAM
Battery monitoring Measuring circuit in the central module
Diagnostic system in the central module with 4 digit alphanumeric
display and 2 LEDs
Diagnoses/displays information of the user program
Errors in the central device, I/O bus,
in safety-related I/O modules, interfaces
Memory capacity for 320 kbyte
user (logic, parameters, variables)
Basic cycle time 5 ms for single channel systems,
27 ms for redundant systems
To Next Page
Loading...
Need help?
General