Figure 7-82 CPU carrier with the CPU inside
Step 9 Determine the area on the CPU for contacting the heat sink, and apply 0.4 ml of
thermal compound on the area.
The thermal compound injector has volume marks.
Methods for pasting thermal compound are shown in Figure 7-83. Dual-line, x-
shape,
ve-point, and s-shape pasting methods are recommended.
Figure 7-83 Thermal compound application methods
Step 10 Use a clean card to smear the thermal compound over the entire center of the
CPU and ensure that the CPU carrier is free of thermal compound.
The thermal compound layer is as thick as a common piece of paper. Figure 7-84
shows the smeared thermal compound layer. Ensure that the thermal compound is
evenly and fully applied.
RH2288H V3 Server
User Guide 7 Replacing Parts
Issue 46 (2022-12-28) Copyright © Huawei Technologies Co., Ltd. 223
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