. . . . .
PREPARATION FOR USE
Insulation (Minimizing Heat Conductivity)
TP04300 Series Interface & Applications Manual 2-47
Insulation (Minimizing Heat Conductivity)
Before the testing of devices is initiated, at either elevated and/or reduced temperatures, the
DUT site should be carefully prepared by inserting insulation materials to minimize undesired
paths of heat transfer and to reduce moisture inflows to the DUT site:
1. Minimize heat transfer by thermal conductivity from the DUT socket site (within the ther-
mal cap) to the external test equipment to increase efficiency (and reduce moisture infil-
tration)
2. Protect components on the tester board in the vicinity of the DUT from the temperature
extremes of the ThermoStream air flow
As mentioned earlier, utilizing a thermal shroud confines the temperature controlled air within
the immediate area around the DUT and socket (see Attaching the Thermal Cap and Shroud,
page 2-15).
Temperature transition times, however, are dependent on mass, specific heat characteristics
and the thermal coupling and thermal conduction paths to the DUT, test socket, test leads, and
other fixturing features. To minimize conductivity, fit and seal insulation materials as given
below.
Insulation Kits,
Fitting and Sealing
10321IA.jpg
Each TP04300 is supplied with a standard insulation kit (P/N ZAK40480) which contains three
sheets (1/8-, 1/4-, and 1/2-inch thick) of 12-inch square silicone foam material.
To Next Page
Loading...
Need help?
General
