. . . . .
PREPARATION FOR USE
Overview
TP04300 Series Interface & Applications Manual 2-49
Section L:
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Turnkey Test Enclosures
Overview
Temptronic Corporation can offer the end user a turnkey solution to thermal testing
requirements by providing optional test enclosures in two configurations:
Standard (previously designed, tested, configured for a broad range of applications)
Custom (designed for a unique, application-specific test environment)
Temptronic has been successfully designing and delivering such test enclosures for over
twenty-five years.
These enclosures are available to integrate with any of the major testers or probers, can be fully
ATE compatible with convenient “plug in” tester interfaces, and they provide true, accurate
temperature control over and beyond the MilSpec temperature range.
These enclosures apply to testing, characterization and failure analysis of printed circuit boards
(PCBs), component arrays, hybrids, and small electronic and electromechanical
subassemblies, including multichip modules (MCMs), radio frequency (RF), microwave, or
digital high speed, high power devices, and provide ESD-free and frost-free test environments.
In this Section
Topic See Page
ThermoFixture Enclosure 50
Custom Thermal Test Enclosure 51