YASKAWA T1000V - Installation to an External Heatsink (Finless Drive)

2.2 Mechanical Installation
YASKAWA ELECTRIC SIEP C710606 44B YASKAWA AC Drive T1000V Technical Manual 39
Mechanical Installation
2
Table 2.9 Finless Drive
◆ Installation to an External Heatsink (Finless Drive)
The mating surface shall have the following properties:
• Surface flatness shall not exceed 0.05 mm across the entire mating surface.
• Surface roughness shall not exceed 25 S.
Note: A surface roughness of 25 S means “Ra” (average roughness) is not greater than 6.3 a and “Ry” (maximum peak) is not greater
than 25 μm.
■ Thermal Compound
Apply a thermal compound between the heatsink plate and the mating surface. The thermal compound assists in drive
heat dissipation.
Yaskawa recommends the thermal compounds in Table 2 .10.
Table 2.10 Recommended Heatsink Plate Thermal Compounds
Spread the required amount of thermal compound over the clean heatsink plate. Firmly press the T1000V finless drive
against the metal panel and hold it in place against the heatsink plate for a few seconds. Wipe away any excess thermal
compound from around the heatsink plate edges.
Voltage Class
Drive Model
CIMR-TC
Dimensions (mm)
W H D W1 H1 H2 H3 H4 H5 t1 d
Weight
(kg)
Three-Phase
200 V class
2V0030J 140 260 145 122 248 6 234 13 5 5 M5 3.2
2V0040J 140 260 145 122 248 6 234 13 5 5 M5 3.2
2V0056J 180 300 147 160 284 8 270 15 5 5 M5 4.6
2V0069L 220 350 152 192 336 7 320 15 5 5 M6 7.0
Three-Phase
400 V class
4V0018J 140 260 145 122 248 6 234 13 5 5 M5 3.1
4V0023J 140 260 145 122 248 6 234 13 5 5 M5 3.2
4V0031J 180 300 147 160 284 8 270 15 5 5 M5 4.3
4V0038J 180 300 147 160 284 8 270 15 5 5 M5 4.6
Manufacturer Type Model Required Amount
Shin-Etsu Chemical Inc. Oil-based compound G746
100 μm (0.0039 in)
(Varies in accordance with the flatness of the metal
panel.)
Dow Corning Toray Inc.
Silicone compound for heat
dissipation
SC4471CV
4-d
W
W1
H
H1
H2
H4
H3
H5
D
t1