YASKAWA T1000V - Selecting an External Heatsink (Finless Drive)

2.2 Mechanical Installation
YASKAWA ELECTRIC SIEP C710606 44B YASKAWA AC Drive T1000V Technical Manual 41
Mechanical Installation
2
Table 2.12 Parameter Settings
Figure 2.5
Figure 2.5 Output of Heatsink Plate Temperature by Analog Output
Note: 1. Accuracy of the temperature reading between 50ºC and 100ºC may vary ±5ºC.
2. The heatsink temperature is affected by the ambient temperature. Never exceed the allowable maximum heatsink plate temperature.
■ Drive Overheat Alarm (oH)
Set L8-02 to have the drive output an alarm when the heatsink plate exceeds a specified temperature.
L8-03 determines the action taken by the drive when an oH alarm is triggered. Refer to the T1000V Technical Manual for
more details.
◆ Selecting an External Heatsink (Finless Drive)
■ Data Required for Heatsink Selection
Table 2.13 shows the data needed to select a heatsink suitable for the drive and application.
Table 2.13 Data Required for Heatsink Selection
No. Name Description
H4-01 Analog Output Terminal AM Function Selection
00408
(heatsink plate temperature)
H4-02 Analog Output Terminal AM Gain 100.0%
H4-03 Analog Output Terminal AM Bias 0.0%
Symbol Description
P
Loss
Drive heat loss
Refer to Drive Watt Loss Data on page 313 to check the amount of heat loss from the heatsink plate of the drive.
T
HSP_max
Maximum heatsink plate temperature
This is the temperature at the surface of the heatsink plate. It can be monitored with U4-08. The maximum allowable value
depends on drive model.
CIMR-TCBV, CIMR-TC2V0001 to 0020, CIMR-TC4V0001 to 0011: 90ºC
CIMR-TC2V0030 to 0069, CIMR-TC4V0018 to 0038: 80ºC
T
Amb
External heatsink ambient temperature (air temperature around heatsink)
Rθ
HSP
Heatsink plate thermal resistance
This value is 0.05 K/W
Rθ
HSP-EHS
Thermal resistance between the heatsink plate and the external heatsink.
Calculated as
A
th
Heat transfer area between drive heatsink plate and external heatsink.
Note: Due to uneven heat generation across the heatsink plate (by arrangement of internal components) the effective area for heat
transfer is lower than 70% of the heatsink plate area. This must be considered when calculating the thermal resistance.
Refer to Figure 2.6 for values of H and W to calculate the area of the heatsink plate.
λ
Comp
Thermal conductivity of the heatsink thermal compound
d
Comp
Thickness of the thermal compound
Rθ
EHS
Thermal resistance of the external heatsink
0
Output Voltage㧔V㧕
10.0
9.0
5.0
9050 100
Temperature（°C）
Rθ
HSP-EHS
=
d
Comp
λ
comp
 A
th