HP 3000 9x9KS - Firmware Differences; Expanded Chiprevision Information; Configuration Issues; Memory for Hp9000;Kx70;Kx80 Servers

D-2 New System Features
Firmware Differences
Expanded ChipRevision Information
In the PDC, the ChipRevision command in the Information Menu has been modified to provide additional
information. Following is an example of the new CR command:
Main Menu: Enter command or menu > in cr
Module Revision
------ --------
System Board 1
PA 8200 CPU Module 5.1
PA 8200 CPU Module 5.1
PA 8200 CPU Module 5.1
PA 8200 CPU Module 5.1
PA 8200 CPU Module 5.1
PA 8200 CPU Module 5.1
PDC Firmware 502
Tower 9
Memory Carrier 0 Regular
Memory Carrier 1 Not present
I/O Bus Adapter 0 15
Shrike Board 1
Zalon 2
I/O Bus Adapter 1 15
Core I/O Board 1
Zalon 2
GeckoBoa Not available
NIO module 0
Lasi 0
GeckoBoa Not available
HSC 1 (40MHz)
HSC 2 (32MHz)
Main Menu: Enter command or menu >
Configuration Issues
Beginning with this edition of the service manual, special configuration issues will be identified in this
section:
Memory for HP9000/Kx70/Kx80 Servers:
Kx70/Kx80 systems with four to six CPUs that use the minimum 256MB memory size REQUIRE that the
memory consist of at least four SIMMs (two modules).