HP xw4300 - Removal and Replacement Procedures

Removal and Replacement
Procedures
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4 Removal and Replacement Procedures
This chapter describes removal and replacement procedures of most internal components.
• Section 4.1 “Service Considerations”
• Section 4.2 “Pre-Disassembly Procedures”
• Section 4.3 “System Board”
• Section 4.4 “Steps for Removal and Replacement of Components”
• Section 4.5 “Disassembly Order”
• Section 4.6 “Security Lock (Optional)”
• Section 4.7 “Cable Lock (Optional)”
• Section 4.8 “Universal Chassis Clamp Lock (Optional)”
• Section 4.9 “Access Panel”
• Section 4.10 “Hood Sensor”
• Section 4.11 “Solenoid Hood (Smart Cover) Lock (Optional)”
• Section 4.12 “Front Bezel”
• Section 4.13 “Bezel Blanks”
• Section 4.14 “Front Panel I/O Device Assembly”
• Section 4.15 “Power Button”
• Section 4.16 “System Speaker”
• Section 4.17 “Power Supply”
• Section 4.18 “System Fan”
• Section 4.19 “Memory”
• Section 4.20 “Peripheral Component Interconnect (PCI) Slots”
• Section 4.21 “Front Fan (Optional)”
• Section 4.22 “Battery”
• Section 4.23 “Power Connections”
• Section 4.24 “Optical Drive (Minitower Position)”
• Section 4.25 “Optical Drive (Desktop Position)”
• Section 4.26 “Diskette Drive”
• Section 4.27 “SCSI Hard Disk Drive”
• Section 4.28 “SATA Hard Drive”
• Section 4.29 “CPU Heatsink”
• Section 4.30 “Processor”
• Section 4.31 “System Board”