Panasonic SP28P - Production Process

Page 1-7
GENERAL DESCRIPTION
1
1E4C-E-OMA01-A02-00
1-2 Production Process
This section describes the production mechanism in due order.
1. Board is transported from the previ-
ous process to the conveyor (left).
2. It is transported from the conveyor
(left) to the board holder.
3. It is clamped in the Y-axis, and the
support rises up.
∗ That the support rises up and then the board is
clamped is also available.
4. The board holder moves to the posi-
tion of recognition camera.
5. The board is recognized.
1. The board holder moves to the print-
ing position.
2. The lifter rises up to the surface of
mask, then solder is printed by
squeegee.
3. The lifter lowers from the surface of
mask to the transport height.
∗ When the specified printing count has been
performed, mask is cleaned.
( To the next page)
1. Board is unclamped and the support
lowers.
2. It is transported from the board
holder to the conveyor (right).
3. When the signal comes from the next
process, it is carried out.
1 Transporting board in
• The board transported in from the previous process
is set in the board holder and the machine is ready
for printing.
2 Printing solder
• Solder is printed on board.
3 Transporting board out
• Board is transported out of the board holder to the
next process.
1B4C-039E
1B4C-041E
Previous
process
Next
process
Conveyor (Left) Conveyor (Right)
1B4C-040E
Previous
process
Next
process
Conveyor (Left)
Conveyor (Right)
Mask
Board
Squeegee
Solder