Rockwell Automation Publication 2198-UM001M-EN-P - November 2022 75
Chapter 5 Connect the Kinetix 5500 Drive System
Ground Multiple Subpanels
In this figure, the chassis ground is extended to multiple subpanels.
Figure 44 - Subpanels Connected to a Single Ground Point
High-frequency (HF) bonding is not illustrated. For HF bonding information,
see Bonding Multiple Subpanels on page 40
.
Follow NEC and applicable
local codes.
Bonded Ground Bus
Ground Grid or Power
Distribution Ground
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