24 WaveRIDER
WaveRIDER Parameter (3) Problem (1)
A36-9283-06 Rev 1.2
Solder Wave Parallelism
Solder Wave Immersion Depth
Solder Wave Contact Lengths (A, B, C)
Solder Wave Dwell Times (A, B, C)
Solder Wave Temp
Delta Temp at Solder Wave
Chip Wave Parallelism
Chip Wave Immersion Depth
Chip Wave Contact Lengths (A, B, C)
Chip Wave Dwell Times (A, B, C)
Chip Wave Temp
Delta Temp at Chip Wave
Conveyor Speed
Maximum Preheat Slope
Minimum Preheat Temperature
Maximum Preheat Temp.
Potential Cause (2)
Cracked Components
Solder Balls on Assembly
Cold Solder Joints
Grainy or Disturbed Joints
Solder Wave Over Flooding Board
Unfiltered Via Holes
Solder Bridges
Solder Skips
1
2
1
2
3
Conveyor speed too fast….Reduces dwell time in wave and forces preheat to be to high
3
3
3
3
1
1
2
3
Preheat temp low….Solder pads not within 100°F of solder wave temperature
3
3
3
1
2
1
2
3
Conveyor speed too low….increases dwell time in solder wave
3
2
3
Carrier bent or damaged….Board must run parallel (flat) over wave
2
3
3
2
2
Conveyor fingers bent….Board may not be parallel over solder wave
2
2
2
Vibrator, 2nd wave OFF….Solder is not evenly distributed
3
3
Flux applied is insufficient….Spotty application or weak activity flux
3
1
2
3
3
Rails not parallel (flat) over nozzles….One side of board deeper in solder wave than the other
1
2
2
3
1
2
Wave or nozzles not level….Must be parallel to conveyor
1
1
2
3
1
3
1
Wave temperature too high….Solder and components are getting cooked
3
2
Conveyor width too tight….May warp board up or down while in wave
3
1
1
1
2
3
Preheat too high….Heating slope is too steep
2
2
Assembly too heavy….Weight or components bending board
3
Board too wide….Wide boards lack strength to support their weight
3
1
3
1
3
3
Conveyor jerky or vibrating….Disturbs solder joints while cooling
3
Flux not uniform across bottom of board….Spotty application of flux
3
1
1
3
3
Preheat slope too steep….Heats components faster than recommended
3
3
3
3
3
Chip wave OFF….Solder is not evenly distributed
3
3
3
3
3
Chip wave activity too low….Solder is not evenly distributed
3
3
3
3
Wave height/exit incorrectly set….Exit speed of solder should match conveyor speed
3
Wave solder splash….Too active wave splashes solder on exit
3
3
Assembly removed too early….Solder not hardened before distributed
3
Carrier too tight….May warp board up or down while in wave
3
3
3
3
3
3
3
Conveyor too low….Boards below wave
3
3
3
3
2
2
Chip nozzle clogged….Solder is not evenly distributed
3
Vibrator, 2nd wave too low
3
3
Wave height too high….Wave height greater than thickness of board
3
Flux air knife too strong….Blows flux off board
2
Board not run in best direction….Component shadowing
1
1
Flux activator low….Low flux density
2
Flux activity too low….Flux not aggressive enough
2
2
3
Cooling rate too slow….Solder not hardened before distributed
1
Dross recirculating from pot to wave….Excessive dross build up
1
Pallet center support missing or poor
1
2
3
3
Vibrator, 2nd wave too high….Causes splashing of liquid solder
1
2
3
Chip wave lower in spots….Solder is not evenly distributed
1
Air knife after wave set incorrectly….Air knife not effectively blowing off excess solder
1
Flux liquid in holes….Flux density too high or too much flux applied to board
1
< 0.3 sec
0.062
2.0 inches
3 sec
495°F
100°F
< 0.3 sec
.062 inches
0.5 inches
1 sec
495°F
N/A
4 ft/Min
5°F/Sec
Room Temp
225°F
3 = High Impact
2 = Moderate Impact
1 = Low Impact
Typical Values
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