Lucent Technologies DDM-2000 OC-3

363-206-285
Applications
Issue 3 June 2001
2-69
High Bit Rate Subscriber Line (HDSL) Application. 2
The HDSL circuit pack (BBF8) provides HDSL interface capability on the
DDM-2000 OC-3 shelf to compatible PairGain
®
equipment at the customer
premises. It allows the transport of T1 payloads, for up to 12,000 feet, over two
metallic 24 AWG twisted-pair lines. Figure 2-47 shows examples of HDSL circuit
packs providing this capability in both the DDM-2000 OC-3 and the DDM-2000
FiberReach shelves. Applications for business customers, the private network,
cell sites, PBXs, customer premises equipment (CPE), and other applications are
supported.
The BBF8 circuit pack fits into the low-speed slots and provides two, four-wire
HDSL interfaces. Each interface provides a full DS1 payload capacity mapped to
a SONET VT1.5 and then VT cross-connected into an STS-1. Once in SONET,
the DS1 payload is treated as a normal DS1.
*
* Note that the HDSL circuit pack can be installed in DDM-2000 OC-3 shelves running linear
Releases 6.2 and later, and ring Releases 7.1 and later. Refer to information included with
each circuit pack for provisioning instructions.