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Lucent Technologies DDM-2000 OC-3 User Manual

Lucent Technologies DDM-2000 OC-3
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363-206-285
Circuit Pack Descriptions
7-44 Issue 3 June 2001
BBF8 High bit rate Digital Subscriber Line 7
Purpose of Circuit 7
The HDSL circuit pack (BBF8) provides HDSL interface capability on the
DDM-2000 OC-3 shelf to compatible
PairGain
®
equipment at the customer
premises. It allows the transport of T1 payloads, for up to 12,000 feet, over two
metallic 24 AWG twisted-pair lines.
The BBF8 circuit pack fits into the low-speed slots and provides two, four-wire
HDSL interfaces. Each interface provides a full DS1 payload capacity mapped to a
SONET VT1.5 and then VT cross-connected into an STS-1. Once in SONET, the
DS1 payload is treated as a normal DS1.
HDSL Faceplate Indicator 7
TheHDSLcircuitpackFAULTindicatorisshowninFigure7-17.ThisredFAULT
LED is lit by the SYSCTL on detection of an HDSL circuit pack failure. In the event
of an incoming signal failure, this LED flashes on and off.
Figure 7-17. BBF8 HDSL Circuit Pack
S1:1
BBF8
HDSL
tpa 852341/01
Lucent
FAULT

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Lucent Technologies DDM-2000 OC-3 Specifications

General IconGeneral
BrandLucent Technologies
ModelDDM-2000 OC-3
CategoryMultiplexer
LanguageEnglish

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