Orbotech SPTS Xactix e1 Series - Performing an Etch in the Normal with Delays Mode

Manual Version e1-4.3.0.ae-R3. Page
59
5.3.6 Performing an Etch in the Normal with Delays Mode
An additional etch mode included with the system is Normal with Delays which allows for a pause
between etching cycles. This pause is intended to allow the sample being etched to cool between
etching cycles and its screen is shown below:
5.3.6.1 Normal with Delays Mode Etching Variables
Number of cycles
Since the e1 Series is primarily a pulsed xenon difluoride etching system, the duration of etching is
controlled by the number of cycles. A cycle consists of the xenon difluoride sublimating to the set
pressure in the expansion chamber, etching for a set amount of time and evacuation of the main
chamber and expansion chamber.
Etch Time
When the valve between the main chamber and expansion chamber is opened the pressure
equilibrates and the etching process begins. The etch time is the time between the opening of the valve
between the expansion chamber and the process chamber and the opening of the valve between the
process chamber and the pump.
Etch Delay
The etch delay is the time in seconds that the system waits before beginning the next etching cycle.
XeF
2
Pressure
In order to introduce the proper amount of xenon difluoride into the main chamber a set pressure
charge of xenon difluoride must be delivered to the expansion chamber. Because xenon difluoride has
a vapor pressure of ~4T at room temperature the upper limit for the XeF
2
pressure is approximately 4T.