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Orbotech SPTS Xactix e1 Series - Installation and Initial Setup; Site Requirements and Connections

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Manual Version e1-4.3.0.ae-R3. Page
14
3 Description of the product; composition of the product
Thank you for purchasing the XACTIX
®
e1 Series xenon difluoride etching system.
XeF
2
(xenon difluoride) isotropic silicon etching is particularly well suited to MEMS applications. XeF
2
vapor phase etching exhibits nearly infinite selectivity of silicon to photo-resist, silicon dioxide, silicon
nitride and aluminum. Being a vapor phase etchant, XeF
2
avoids many of the problems typically
associated with wet processes. K. Pister discusses the use of xenon difluoride, as an etchant for MEMS
applications, in part in US patent number 5,726,480.
The Xactix e1 Series is the ideal solution for those seeking a cost effective R&D xenon difluoride etch
system. Built for high etch uniformity, simplicity, low cost of ownership, and a small footprint, the e1
Series is well suited for both research laboratories and universities.
This manual covers un-crating, installation, initial start-up, operation, and maintenance of the unit.
To use the e1 Series, simply place your wafer, die, or other structure into the etch chamber, close the
lid, set the etching conditions, and press start on the software. The details of the process sequence are
captured in the control software, and the user just has to set target etch conditions. Etch progress is
easily monitored using the stereomicroscope located above the transparent chamber lid.
Installation is very easy since only 120V AC input (220V AC option available); dry compressed air,
nitrogen, system and chamber area fume exhaust, and a pump exhaust line are required. The XeF
2
canister is contained within the etch system. The combination of a robust design, tested etchant control
software, top quality components, and experienced workmanship results in a dependable and flexible
etching tool for your research needs.
The e1 Series is a system designed to expose samples to xenon difluoride gas in either a cyclic
(pulsed) mode in which the etch chamber is repeatedly filled with XeF
2
gas and pumped out again.
Depending on the options purchased with the system, the e1 Series can be fitted with the following
components:
Microscope
Multiple process software modules
Electronic image capture of the process chamber

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