Manual Version e1-4.3.0.ae-R3. Page
Etch Time
When the valve between the main chamber and expansion chamber is opened the pressure
equilibrates and the etching process begins. The etch time is the time between the opening of the valve
between the expansion chamber and the process chamber and the opening of the valve between the
process chamber and the pump. Note that there is a range button which changes the slider range for
selecting larger numbers.
XeF
2
Pressure
In order to introduce the proper amount of xenon difluoride into the main chamber a set pressure
change of xenon difluoride must be delivered to the expansion chamber. Because xenon difluoride has
a vapor pressure of ~4T at room temperature the upper limit for the XeF
2
pressure is approximately 4T.
Due to the slightly elevated temperature inside of the etcher cabinet, you may be able to get
considerably higher XeF2 pressures.
Pump-out Pressure
The pump-out pressure allows the user to set the pressure to which the process and expansion
chambers are pumped down to during the evacuation portion of the cycle. The above variables can be
set either by moving the white slider on the scroll bar or by tapping or depressing on the arrows at the
top and bottom of the scroll bar to increment each value.
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