上海维宏电子科技股份有限公司
SHANGHAI WEIHONG ELECTRONIC TECHNOLOGY CO., LTD.
3.4 Return to the Center ...................................................................................................... 32
3.5 Set Automatic Centering ............................................................................................... 32
4 Object Operations ........................................................................................................................ 34
4.1 Drawing Operations ....................................................................................................... 35
4.2 Auxiliary Editing Operations ...................................................................................... 38
4.3 Basic Editing Operations .............................................................................................. 44
4.4 Preprocessing Operations ........................................................................................... 62
5 Technics .......................................................................................................................................... 68
5.1 Set Fill or Unfill ................................................................................................................ 68
5.2 Set a Lead Line ................................................................................................................. 69
5.3 Change the Machining Direction ............................................................................... 73
5.4 Change the Machining Order ...................................................................................... 75
5.5 Compensate Kerf ............................................................................................................. 78
5.6 Execute Instant Setting ................................................................................................. 79
5.7 Set Scan Cutting ............................................................................................................... 81
5.8 Add Cooling Points ......................................................................................................... 83
5.9 Add Release Angles ........................................................................................................ 85
5.10 Add Chamfer ................................................................................................................. 86
5.11 Bridge Objects .............................................................................................................. 88
5.12 Execute Micro Joint .................................................................................................... 89
5.13 Explode Micro Joint .................................................................................................... 91
5.14 Chop Objects ................................................................................................................. 92
5.15 Execute Ring Cut ......................................................................................................... 93
5.16 Do Clearing .................................................................................................................... 94
6 Layer Function .............................................................................................................................. 95
6.1 Interface Overview ......................................................................................................... 96
6.2 Layer Operations ............................................................................................................. 97