Table 20. Thermal monitor configuration
I2C write Description
0x77 0x0 0x0B Program primary I2C bus multiplexer (PCA9547PW) to get access to
I2C1_CH3 (I2C sub-channel for SA56004ED/SA56004FD)
0x4C 0x19 <TLIMIT> (thermal monitor 1)
0x4D 0x19 <TLIMIT> (thermal monitor 2)
Program the thermal limit of SA56004ED/SA56004FD external
measurement (the processor). <TLIMIT> can be any user-defined value,
for example, decimal 50.
The SW_BYPASS_B switch (SW4[1]) disables thermal monitoring. This may be necessary if operating the board
without a processor installed, as an open thermal diode connection will measure as 127 °C.
NOTE
2.17 DIP switches
The LX2160ARDB provides dual inline package (DIP) switches to allow easy configuration of the system for the most popular
board options. These switches are stored in BRDCFG and DUTCFG registers by CPLD before being used, allowing software
(either local or remote) to reconfigure the system as needed.
The table below explains the DIP switches available in the LX2160ARDB. For each DIP switch:
• If the switch is up (on), the value is 1
• If the switch is down (off), the value is 0
Table 21. Switch settings
Switch Supported function Description
SW1[1:4] RCW fetch location
CFG_RCW_SRC[3:0]
SW_RCW_SRC[3:0]
• 0000: Hard-coded RCW
• 1000: SDHC1: SD card
• 1001: SDHC2: eMMC
• 1010: I2C boot EEPROM
• 1100: XSPI sNAND, 2 KB pages
• 1101: XSPI sNAND, 4 KB pages
• 1111: XSPI serial NOR, 24-bit address (default setting)
SW1[5] Reset mode
RESET_REQ_B
SW_RST_MODE
• 0: Ignore RESET_REQ_B
• 1: Trigger system reset on assertion of RESET_REQ_B (default setting)
SW1[6:8] XSPI_A device mapping
CFG_XSPI_MAP[3:0]
SW_XMAP[2:0]: Controls how XSPI_A chip-selects are connected to
devices/peripherals.
Bit value XSPI_A_CS0 XSPI_A_CS1 Description
000 (default
setting)
DEV#0 DEV#1 Boot from default
flash memory
NXP Semiconductors
LX2160ARDB Functional Description
QorIQ LX2160A Reference Design Board Reference Manual, Rev. 4, 07/2020
Reference Manual 42 / 116
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