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To avoid overheating, when ambient temperatures are high, take into consideration the heat
dissipated in the electronics cabinet. This is particularly important for cabinets with protection
degree (IP41, IP54) with considerable circuit board equipment and ambient temperatures at
levels approaching 40°C.
The frequency of faults is estimated to be doubled for each 20°C increase in temperature.
It is, therefore, important to maintain as low a temperature as possible where the equipment is
installed.
The different hardware modules in the controller and the I/O system have different outputs of
heat. Accurate calculation of the heat produced by the system requires knowledge of the
modules and the work cycle.
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The maximum permitted temperature below the subracks in the cabinet is 55°C.
The permissible amount of heat generated depends on the type of cabinet and its location.
Appendix B, RM500 Cabinet - Data Sheet indicates the heat generated to give a 15°C
temperature rise and a 30°C temperature rise in the cabinets. The figures are valid for cabinet
type RM500.
The standard design and assembly of cabinets aim to give a maximum of 15°C temperature rise
within the cabinet, which results in a maximum permitted ambient temperature of 40°C
(55°C - 15°C).
In critical applications with subracks fully equipped and cabinets arranged in groups, you may
need to make a calculation of the actual power dissipation and an estimation of the temperature
rise within the cabinet. Calculation is recommended at system enlargement too.
Some data to be used in calculations is given below. Power dissipation for different hardware
modules is collected in Appendix E, Current Consumption and Heat Dissipation.
Cabinets including a single subrack normally have no temperature rise higher than 15°C,
irrespective of the disposition of the subrack, cabinet type and location of the cabinet.