Distribution of I/O capability can be easily achieved with the G3 platform by means of Sub-Bus modules.
I/O modules, valve manifolds and/or a combination of both can be simply separated from the main
manifold and distributed via a sub-bus communication cable. The G3 platform uses the same I/O
modules on the main manifold as on the distribution chain. The main communication module can control
up to 16 I/O modules either on the main manifold or as part of the sub-bus connections. To utilize the
sub-bus distribution capabilities the Sub-Bus OUT module must be located on the end of the main
communication manifold and a Terminator Module must be located at the last sub-bus component.