723–0018 /02 F70138
Image 19-11
Heatsink stud and cooling surface may be bonded to DMD and Front side heatsink by the thermal
paste. Some force may be required to split the two heatsink assemblies.
19.4 GP7 PCB DMD Board
1. Remove 4 screws (Tx8 M25x10) diagonally
2. Carefully remove the DMD backer plate.
3. Remove 4 spacers (4mm hex) and release the DMD board.
Image 19-12
Note: Plastic insulation film is applied to the DMD backer plate. Film must be facing the DMD board.
19.5 CLGA & DMD
About
The CLGA is the connector panel sandwiched between the PCB DMD and the DMD device. It is important it is
kept free of contaminants if serviced. Each contact point of the CLGA is a “C” shaped spring which secures
adequate tension between pads on DMD boards and the DMD chip.
Technical operations
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