D3-DU 3xx/A, /B Technical data
Project engineering manual V1.09
113
© KEBA 2021
12.3 Environmental conditions
Operating temperature: +5 °C to +55 °C
Storage temperature: -25 °C to +70 °C
Relative humidity of air: 10 % to 95 % (non condensing)
Vibration resistance: According to EN 61131-2:2007
Shock resistance: According to EN 61131-2:2007
Operating altitude: max. 2,000 m
Compliance with the conditions according to EN 60068-2-6 related to the
values specified under "Technical characteristics" is mandatory for storage
and transport.
12.4 Computer kernel
Processor (functional control):
● -..-0x Intel Atom E660 1.3 GHz
● -..-2x Intel Atom E3845 1.9 GHz
● -..-0x Intel i3 2310E 2 x 2.1 GHz
● -..-2x Intel Celeron 3955U 2.0 GHz
Memory (functional control):
● D3-DU 33x/x-..-0x 1 GB DDR2-SDRAM
● D3-DU 33x/x-..-2x 2 GB DDR3-SDRAM
● D3-DU 36x/x-..-0x 1 GB / 2 GB DDR3-SDRAM
● D3-DU 36x/x-..-2x 2 GB / 4 GB DDR3L-SDRAM
Battery-buffered SRAM:
1 MB (for available memory for retain data
see system manual)
The optional safety control is equipped with two redundant processors.
12.5 Interfaces
EtherCAT interface
Quantity: 1
Ethernet interface
Quantity: 2
Data transfer rate: 10 / 100 / 1,000 Mbit/s
Galvanic isolation: Yes, signal connections
Master fieldbus (optional):
Quantity:
● EtherCAT: 1
● Sercos III: 1
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