Keba KeDrive D3-DU 3 A Series - Dismantling of the Module

D3-DU 3xx/A, /B Mounting and installation instructions
Project engineering manual V1.09
49
© KEBA 2021
DU 3xx/x size BG1 DU 3xx/x size BG2
Surface of the cooler
2)
max. roughness R
Z
= 6,3
1)
Thermal resistance between active cooling surface on the device and
cooler.
2)
In this case the cooled rear panel for mounting the module is called as
cooler.
5.4.2.1 Sizing the cooler
DU 3xx/x size BG1 DU 3xx/x size BG2
Thermal resistance R
th
K
1)
0.02 K/W 0.01 K/W
Thermal capacity of the cool-
ing plate on the device
390 Ws/K 780 Ws/K
Max. temperature cooling
plate Device
85 °C
Surface of the cooler
2)
max. roughness R
Z
= 6.3
1)
Thermal resistance between active cooling surface on the device and
cooler.
2)
In this case the cooled rear panel for mounting the module is called as
cooler.
5.5 Dismantling of the module
During the disassembly of the module it needs to be ensured and checked
that it is absolutely de-energized (see chap. "Power supply").
Caution
The disassembly must not lead to damage to the enclosure, the mother-
board, the plugs or the cables.
Zur Demontage der Baugruppe gehen Sie wie folgt vor:
1) De-energize all devices.
2) Disconnect all electric connections, loosen grounding bracket if existing.
3) Unfasten the fixing screws, be careful that the screws remain in the
mounting plate.
4) Lift and pull out the moduel.
The module is disassembled.