36 HB V2.0/Dez-11 © 2011 LPKF AG
3.3 Conditions of use
The circuit board plotter can be used for production of single and multi-sided
circuit boards. Processing of signs as well as housing parts e.g. back or front
plates are acceptable likewise.
Permitted machining processes are:
Milling and drilling of single and double sided base material
Milling and drilling of multilayer material
Milling of SMD soldering paste stencils
Milling of solder resist mask
Engraving of signs or housing plates
Perforation of flat materials
Milling of cut-outs and outlines
The following materials are permitted for this circuit board plotter:
PTFE or ceramic-filled base material
Nonferrous materials as:
- Aluminium acc. to DIN EN 573:EN AW-6012
- Brass acc. to DIN EN 1412: CW603N
Plastics as:
- Polyoxymethylen
- ABS-Copolymere
The circuit board plotter may only be operated for the machining processes and
materials listed in this chapter.
The circuit board plotter may only be operated using the delivered control
software CircuitPro.
Please contact the LPKF service at once if you wish to use an
other control software as the delivered item!
The circuit board plotter may only be start up with a sufficient dust extraction
and a fine particle filtering.
We recommend the LPKF dust extraction system with
integrated HEPA filter.
Please contact the LPKF service first if you plan to use an
other dust extraction system.