© 2011 LPKF AG HB V2.0/Dez-11 87
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6.9 Dispense
The dispense device is used to apply solder paste on the printed circuit board
before the placement of SMD parts starts. With compressed air the solder paste
will be applied point by point with precision and in small quantity. Also applying
SMD glue or other materials which can be filled into cartridges is called
dispensing.
The dispensing device is included in the delivery for all mill/drill
plotters with automatic tool change function.
The dispense set consists of:
Fig. 63: Complete
dispense set
/4/ Solder Paste cartridge
The solder paste is not included in the scope of delivery and must
be odered separately.
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