6 HB V2.0/Dez-11 © 2011 LPKF AG
4 Transport and storage ....................................................................... 43
4.1 Transport ................................................................................................................. 43
4.1.1 Transport lock ............................................................................................... 43
4.2 Storage ................................................................................................................... 43
5 Installation .......................................................................................... 45
5.1 Assembling conditions ............................................................................................ 45
5.2 Unpacking the device.............................................................................................. 46
5.3 Installation and commissioning ............................................................................... 46
5.3.1 Installation ..................................................................................................... 47
5.3.1.1 Remove the transport lock ...................................................................... 47
5.3.1.2 Connecting the circuit board plotter ......................................................... 48
5.3.2 Commissioning ............................................................................................. 50
5.3.3 Remove the dummy tool ............................................................................... 51
6 Operation ............................................................................................ 53
6.1 Production process ................................................................................................. 53
6.2 Start system ............................................................................................................ 54
6.2.1 Tool status monitoring .................................................................................. 55
6.2.2 Graphical user interface ............................................................................... 56
6.2.2.1 Menu bar ................................................................................................. 57
6.2.2.2 Function bar ............................................................................................. 58
6.2.3 Window Processing ...................................................................................... 59
6.2.3.1 Manual control of the mill/drill head ......................................................... 60
6.2.3.2 Select head .............................................................................................. 61
6.2.3.3 Operate .................................................................................................... 62
6.2.3.4 Move to Position ...................................................................................... 63
6.2.3.5 Head actions ............................................................................................ 64
6.3 Establish a connection ............................................................................................ 65
6.4 Place material ......................................................................................................... 67
6.4.1 Worktable ...................................................................................................... 67
6.4.2 Vacuum table ................................................................................................ 68
6.5 Tool setup ............................................................................................................... 69
6.5.1 Manual tool change procedure ..................................................................... 69
6.5.2 Automatically tool change process ............................................................... 70
6.5.3 Tool colour code ........................................................................................... 72
6.6 Manual drilling ......................................................................................................... 73
6.7 Manual milling ......................................................................................................... 76
6.8 Automatic mode ...................................................................................................... 81
6.8.1 Specify production type ................................................................................ 82
6.8.2 Loading the CBF file ..................................................................................... 84
6.8.2.1 Production of the printed circuit board..................................................... 85
6.9 Dispense ................................................................................................................. 87
6.9.1 Mount dispense set ...................................................................................... 88
6.9.2 Dispense process ......................................................................................... 90
6.10 Shutdown the System ............................................................................................. 93
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