AXC F 1050
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PHOENIX CONTACT 107709_en_00
Figure 4-1 Placing the module vertically
NOTE: Device failure due to operation above the permitted specifications for vi-
brations and shock
If the device is subjected to vibrations and shock levels above the permitted specifications
during operation, this may lead to malfunctions or even device failure.
• Ensure that the permitted specifications for vibrations and shocks are adhered to
when operating the device, see Section 12.1
NOTE: Property damage due to impermissible stress
The IP20 degree of protection (IEC 60529/EN 60529) requires that the device be used in
a clean and dry environment. If you use the device in an environment that is outside of the
specified limits, this may cause damage to the device.
• Do not subject the device to mechanical or thermal stress that exceeds the specified
thresholds.
NOTE: Component breakage and/or short circuit
Inserting the device connectors (RJ45 connectors or USB connectors) into sockets for
which they were not designed can lead to components being broken and/or device short
circuit.
• Plug each connector only into the socket on the device intended for that connector.
NOTE: Damage to the contacts when tilting
Tilting the modules can damage the contacts.
• Place the modules onto the DIN rail vertically (see Figure 4-1).
The controller is automatically grounded (FE) when it is snapped onto a grounded
DIN rail.
There are two FE springs on the back of the controller that make contact with the DIN rail
when the controller is placed on the DIN rail.