MSP-TS430RGC64B
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102
SLAU278Y–May 2009–Revised March 2016
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Hardware
Table B-24. MSP-TS430RGC64B Bill of Materials
Pos. Ref Des
No. per
Board
Description Digi-Key Part No. Comment
1 C1, C2 0 12pF, SMD0805 DNP
2 C3, C4 0 47pF, SMD0805 DNP
3 C6, C7, C10 3 10uF, 6.3V, SMD0805
4
C5, C11,
C13, C14,
C15
5 100nF, SMD0805 311-1245-2-ND
5 C8 1 2.2nF, SMD0805
6 C9 1 470nF, SMD0805 478-1403-2-ND
7 C16 1 4.7uF, SMD0805
8 C17 1 220nF, SMD0805
9 D1 1 green LED, SMD0805 P516TR-ND
10 J1, J2, J3, J4 0 16-pin header, TH
SAM1029-16-ND (Header)
SAM1213-16-ND
(Receptacle)
DNP: Headers and receptacles enclosed
with kit. Keep vias free of solder:
11 J5 , J6 2 3-pin header, male, TH
12
JP3, JP5,
JP6, JP7,
JP8, JP9,
JP10
7 3-pin header, male, TH SAM1035-03-ND
place jumpers on pins 2-3 on JP5, JP6,
JP7, JP8, JP9, JP10 place jumpers on
pins 1-2 on JP3,
13
JP1, JP2,
JP4
3 2-pin header, male, TH SAM1035-02-ND Place jumper on header
14 10 Jumper 15-38-1024-ND See Pos. 12 and Pos. 13
15 JTAG 1 14-pin connector, male, TH HRP14H-ND
16 BOOTST 0 10-pin connector, male, TH "DNP Keep vias free of solder"
17 Q1 0 Crystal
Micro Crystal MS3V-T1R
32.768kHz, C(Load) =
12.5pF
DNP: Q1 Keep vias free of solder
18 Q2 0 Crystal
Q2: 4MHz Buerklin:
78D134
DNP: Q2 Keep vias free of solder
19
Insulating
disk to Q2
0 Insulating disk to Q2
http://www.ettinger.de/Art_
Detail.cfm?ART_ARTNUM
=70.08.121
20 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
21
R1, R2, R4,
R6, R8,
R9,R10, R11,
R12
3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12
22 R5 1 47k Ω, SMD0805 541-47000ATR-ND
23 U1 1
Socket: QFN11T064-006-
N-HSP
Manuf.: Yamaichi
24 PCB 1 85 x 76 mm 2 layers
25
Adhesive
plastic feet
4
Approximately 6mm width,
2mm height
for example, 3M Bumpons
Part No. SJ-5302
Apply to corners at bottom side
26 D3,D4
27 MSP430 2 MSP430F5310 RGC DNP: enclosed with kit, supplied by TI
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