MSP-TS430RGZ48B
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84
SLAU278Y–May 2009–Revised March 2016
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Hardware
Table B-18. MSP-TS430RGZ48B Bill of Materials
Position Ref Des
No. per
Board
Description Digi-Key Part No. Comment
1 C1, C2 0 12pF, SMD0805 DNP
2 C3, C4 0 47pF, SMD0805 DNP
3 C6, C7, C12 3 10uF, 6.3V, SMD0805
4
C5, C11,
C13, C14
4 100nF, SMD0805 311-1245-2-ND
5 C8 1 2.2nF, SMD0805
6 C9 1 470nF, SMD0805 478-1403-2-ND
7 D1 1 green LED, SMD0805 P516TR-ND
8
J1, J2, J3,
J4
0 12-pin header, TH
SAM1029-12-ND
(Header) SAM1213-12-
ND (Receptacle)
DNP: Headers and receptacles
enclosed with kit. Keep vias free of
solder:
9 J5 1 3-pin header, male, TH
10
JP3, JP5,
JP6, JP7,
JP8, JP9,
JP10
7 3-pin header, male, TH SAM1035-03-ND
place jumpers on pins 2-3 on JP5, JP6,
JP7, JP8, JP9, JP10 place jumpers on
pins 1-2 on JP3,
11 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
12 9 Jumper 15-38-1024-ND See Pos. 10and Pos. 11
13 JTAG 1
14-pin connector, male,
TH
HRP14H-ND
14 BOOTST 0
10-pin connector, male,
TH
"DNP Keep vias free of solder"
15 Q1 0 Crystal
Micro Crystal MS3V-T1R
32.768kHz, C(Load) =
12.5pF
DNP: Q1 Keep vias free of solder
16 Q2 0 Crystal
Q2: 4MHz Buerklin:
78D134
DNP: Q2 Keep vias free of solder
17
Insulating
disk to Q2
0 Insulating disk to Q2
http://www.ettinger.de/Art_
Detail.cfm?ART_ARTNUM
=70.08.121
18 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
19
R1, R2, R4,
R6, R8,
R9,R10,
R11, R12
3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12
20 R5 1 47k Ω, SMD0805 541-47000ATR-ND
21 U1 1
Socket: QFN11T048-
008_A101121_RGZ48
Manuf.: Yamaichi
22 PCB 1 81 x 76 mm 2 layers
23
Adhesive
plastic feet
4
Approximately 6mm width,
2mm height
for example, 3M Bumpons
Part No. SJ-5302
Apply to corners at bottom side
24 MSP430 2 MSP430F5342IRGZ DNP: enclosed with kit, supplied by TI
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