MSP-TS430PM64
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90
SLAU278Y–May 2009–Revised March 2016
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Hardware
Table B-20. MSP-TS430PM64 Bill of Materials
Pos. Ref Des
No. per
Board
Description Digi-Key Part No. Comment
1 C1, C2 0 12pF, SMD0805 DNP
1.1 C3, C4 0 47pF, SMD0805
DNP: Only recommendation.
Check your crystal spec.
2 C6, C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND DNP: C6
3 C5 1 100nF, SMD0805 478-3351-2-ND
4 C8 1 10nF, SMD0805 478-1383-2-ND
5 C9 1 470nF, SMD0805 478-1403-2-ND
6 D1 1 green LED, SMD0805 P516TR-ND
7 J1, J2, J3, J4 0 16-pin header, TH
DNP: Headers and receptacles
enclosed with kit.Keep vias free
of solder.
SAM1029-16-ND : Header
SAM1213-16-ND : Receptacle
8 J5 1 3-pin header, male, TH SAM1035-03-ND
9 J6, J7 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
11 2 Jumper 15-38-1024-ND Place on: J6, J7
12 JTAG 1 14-pin connector, male, TH HRP14H-ND
13 BOOTST 0 10-pin connector, male, TH DNP: Keep vias free of solder
14 Q1, Q2 0 Crystal
Q1: Micro Crystal MS1V-T1K
32.768kHz, C(Load) = 12.5pF
DNP: Keep vias free of solder
15 R3 1 330 Ω, SMD0805 541-330ATR-ND
16
R1, R2, R4,
R6, R7, R8,
R9, R10, R11,
R12, R13, R14
3 0 Ω, SMD0805 541-000ATR-ND
DNP: R4, R6, R7, R9, R10,
R11, R12, R13, R14
17 R5 1 47k Ω, SMD0805 541-47000ATR-ND
18 U1 1 Socket: IC51-0644-807 Manuf.: Yamaichi
19 PCB 1 78 x 75 mm 2 layers
20
Rubber
standoff
4 select appropriate Apply to corners at bottom side
21 MSP430 22
MSP430F2619IPM
MSP430F417IPM
DNP: Enclosed with kit supplied
by TI
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