MSP-TS430PN80USB
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122
SLAU278Y–May 2009–Revised March 2016
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Hardware
Table B-30. MSP-TS430PN80USB Bill of Materials
Pos. Ref Des
No. per
Board
Description Digi-Key Part No. Comment
1 C1, C2 0 12pF, SMD0805 DNP: C1, C2
1.1 C3, C4 2 47pF, SMD0805
2 C6, C7 2 10uF, 6.3V, Tantal Size B 511-1463-2-ND
3
C5, C11,
C13, C14
4 100nF, SMD0805 311-1245-2-ND
3.1 C10, C12 0 10uF, SMD0805 311-1245-2-ND DNP: C10, C12
4 C8 1 2.2nF, SMD0805
5 C9 1 470nF, SMD0805 478-1403-2-ND
6 D1 1 green LED, SMD0805 P516TR-ND
7 J1, J2, J3, J4 4 20-pin header, TH SAM1029-20-ND
DNP: headers and
receptacles enclosed with kit.
Keep vias free of solder.
7.1 4 20-pin header, TH
DNP: headers and
receptacles enclosed with kit.
Keep vias free of solder.
SAM1213-20-ND : Header
: Receptacle
8 J5 1 3-pin header, male, TH SAM1035-03-ND
9
JP5, JP6,
JP7,
JP8,JP9,
JP10
6 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 2-3
10 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
JP4 1 SAM1035-02-ND Place jumper only on one pin
11 JP3 1 3-pin header, male, TH SAM1035-03-ND Place jumper on pins 1-2
12 10 Jumper 15-38-1024-ND
Place on: JP1, JP2, JP3,
JP4, JP5, JP6, JP7, JP8,
JP9, JP10
13 JTAG 1 14-pin connector, male, TH HRP14H-ND
14 Q1 0 Crystal
Micro Crystal MS1V-T1K
32.768kHz, C(Load) =
12.5pF
DNP: Q1 Keep vias free of
solder
15 Q2 1 Crystal "Q2: 4MHzBuerklin: 78D134"
16 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
17
R1, R2, R4,
R6, R8, R9,
R12
2 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R6, R8, R9, R12
18 R10 1 100 Ω, SMD0805 Buerklin: 07E500
18 R11 0 1M Ω, SMD0805 DNP
18 R5 1 47k Ω, SMD0805 541-47000ATR-ND
19 U1 1 Socket:IC201-0804-014 Manuf.: Yamaichi
20 PCB 1 79 x 77 mm 2 layers
21
Rubber
standoff
4 Buerklin: 20H1724
Apply to corners at bottom
side
22 MSP430 2 MSP430F5529
DNP: Enclosed with kit
supplied by TI
23
Insulating
disk to Q2
1 Insulating disk to Q2
http://www.ettinger.de/Art_De
tail.cfm?ART_ARTNUM=70.0
8.121
27 C33 1 220n Buerklin: 53D2074
28 C35 1 10p Buerklin: 56D102
29 C36 1 10p Buerklin: 56D102
30 C38 1 220n Buerklin: 53D2074
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