Texas Instruments MSP430

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119
SLAU278Y–May 2009–Revised March 2016
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Hardware
Table B-29. MSP-TS430PN80B Bill of Materials
Position Ref Des
No. per
Board
Description Digi-Key Part No. Comment
1 PCB 1 90.0 x 92.5 mm
"MSP-TS430PN80B" Rev.
1.0
2 layers, blue solder mask
2
JP1, JP2,
JP9, JP13,
JP14, JP15
6 2-pin header, male, TH SAM1035-02-ND place jumper on header
3 JP17, JP18 2 2-pin header, male, TH SAM1035-02-ND place jumper on one side of header
4 JP10, JP11 2 2-pin header, male, TH SAM1035-02-ND DNP, keep pads free of solder
5 J1 1 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 1-2
6
JP3, JP4,
JP5, JP6,
JP7, JP8,
JP16
7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3
7 J2 1 3-pin header, male, TH SAM1035-03-ND
8
R2, R5, R6,
R8, R9
5 0R, 0805 541-0.0ATR-ND DNP
9
R3, R12,
R13
3 0R, 0805 541-0.0ATR-ND
10 C5 1 1.1nF, CSMD0805 490-1623-2-ND
11 C3, C7 2 1uF/10V, CSMD0805 490-1702-2-ND
12 R7, R15 2 10k, 0805 541-10KATR-ND
13 R4 1 47k, 0805 541-47KATR-ND
14
C4, C6,
C10, C11
4 100nF, CSMD0805 490-1666-1-ND
15 R1 1 330R, 0805 541-330ATR-ND
16 R10, R11 2 330R, 0805 541-330ATR-ND DNP
17 R14 1 47k, 0805 541-47KATR-ND DNP
18
C1, C2, C8,
C9
4 DNP, CSMD0805 DNP
19 SW2 1 EVQ-11L05R P8079STB-ND DNP, keep pads free of solder
20 SW1 1 EVQ-11L05R P8079STB-ND DNP, keep pads free of solder
21 TP1, TP2 2 Test point DNP, keep pads free of solder
22 BSL 1
10-pin connector, male,
TH
HRP10H-ND
23 JTAG 1
14-pin connector, male,
TH
HRP14H-ND
24 U1 1 Socket IC201-0804-014 Manuf. Yamaichi
25 MSP device 1 MSP430FR5994 DNP: Not enclosed in kit
26 Q1 1
DNP: MS3V-TR1
(32768kHz, 20ppm,
12.5pF)
depends on application
Micro Crystal, DNP, enclosed in kit,
keep vias free of solder