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MSP-TS430RGZ48C
87
SLAU278Y–May 2009–Revised March 2016
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Hardware
Table B-19. MSP-TS430RGZ48C Bill of Materials
Pos Ref Des
Number
Per
Board
Description Digi-Key Part Number Comment
1 SV1, SV2, SV3,
SV4
4 12-pin header, TH DNP: headers and receptacles enclosed with kit.
Keep vias free of solder.
SAM1029-12-ND : Header
: Receptacle
1.1 SV1, SV2, SV3,
SV4
4 12-pin receptable, TH DNP: headers and receptacles enclosed with kit.
Keep vias free of solder.
: Header
SAM1213-12-ND : Receptacle
2 JP1, JP2, JP9 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header
3 JP10, JP11 2 2-pin header, male, TH SAM1035-02-ND DNP
4 J1, JP3, JP4, JP5,
JP6, JP7, JP8
7 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 2-3
5 J2 1 3-pin header, male, TH SAM1035-03-ND
6 JP1, JP2, JP9, J1,
JP3, JP4, JP5, JP6,
JP7, JP8
10 Jumper 15-38-1024-ND Place on: JP1, JP2, JP9, J1, JP3, JP4, JP5, JP6,
JP7, JP8
7 R2, R3, R5, R6, R8,
R9, R10, R11, R14
9 DNP, 0805 DNP
8 R12, R13, R7 3 0R, 0805 541-000ATR-ND
9 C5 1 1.1nF, CSMD0805 490-1623-2-ND
10 C3, C7 2 1uF, 10V, CSMD0805 490-1702-2-ND
11 R4 1 47k, 0805 541-47000ATR-ND
12 C4, C6 2 100nF, CSMD0805 311-1245-2-ND
13 R1 1 330R, 0805 541-330ATR-ND
14 C1, C2, C8, C9 4 DNP, CSMD0805 DNP
15 SW1, SW2 2 EVQ-11L05R P8079STB-ND DNP
16 BOOTST 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder
17 JTAG 1 14-pin connector, male, TH HRP14H-ND
18 Q1 1 DNP: MS3V-TR1 (32768kHz,
20ppm, 12.5pF)
depends on application Micro Crystal, DNP, enclosed in kit, keep vias free of
solder
19 Q2 1 DNP, Christal depends on application DNP, keep vias free of solder
20 U1 1 Socket: QFN11T048-008
A101121-001
Manuf.: Yamaichi
20.1 U1 1 MSP430FR5969IRGZ DNP: enclosed with kit. Is supplied by TI.
21 D1 1 green LED, DIODE0805 P516TR-ND
22 D3 1 red (DNP), DIODE0805 DNP
23 D2 1 yellow (DNP), DIODE0805 DNP
24 TP1, TP2 2 Testpoint DNP, keep pads free of solder
25 Rubber stand off 4 Buerklin: 20H1724 apply to corners at bottom side
26 PCB 1 79.6 x 91.0 mm MSP-TS430RGZ48C
Rev. 1.2
2 layers, black solder mask
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