Intel
®
Server Board S5500BC TPS Functional Architecture
Revision 1.8 Intel order number: E42249-009 21
3.1.8 Independent Loading Mechanism (ILM) Back Plate Design Support
The Intel
®
Server board S5500BC
processor mounting and Unified Retention System (URS) heatsink retention solution. The ILM
design allows a bottoms-up assembly of the components to the board. The unified back plate
for dual-processor server products consists of a flat steel back plate with threaded studs for ILM
attachment, and internally threaded nuts for attaching the heatsink. The threaded studs have a
knurled feature that attaches the back plate to the motherboard when assembled.
The following diagram illustrates the URS and the Unified Backplate Assembly. The URS is
designed to extend air-cooling capability through the use of larger heatsinks with minimal airflow
blockage and bypass. URS retention transfers load to the baseboard via the Unified Backplate
Assembly. The URS spring, captive in the heatsink, provides the necessary compressive load
for the thermal interface material.
Note: The processor heatsink and ILM backplate shown in the following diagram is for
reference purposes only. The actual processor heatsink and ILM backplate solutions compatible
with this generation of server boards may have a different design.
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