To Next PageTo Next Page
Need help?Do you have a question about the Keysight N9040B Option 508 and is the answer not in the manual?
General| Phase Noise | -136 dBc/Hz at 1 GHz and 10 kHz offset |
|---|---|
| Input Impedance | 50 Ω |
| Input VSWR | < 1.5:1 |
| Resolution Bandwidth (RBW) | 1 Hz to 8 MHz |
| Input Power Range | +30 dBm |
| Analysis Bandwidth | 40 MHz |
| Sweep Time | 1 ms to 1000 s |
Provides an overview of the chapter's contents, including analyzer features, setup, options, and troubleshooting.
General overview of the Keysight UXA signal analyzer's capabilities and features.
Details the various hardware and measurement application options available for the UXA signal analyzer.
Lists and describes optional accessories available to configure the analyzer for specific applications.
Outlines essential tasks and safety considerations before beginning troubleshooting procedures.
Provides essential information on protecting electronic components from electrostatic discharge.
Covers procedures for cleaning the instrument and its connectors.
Lists the necessary test equipment and tools required for troubleshooting, adjustment, and testing.
Detailed list of recommended and alternative test equipment for functional tests and troubleshooting.
Details procedures and tests required after an instrument assembly has been repaired or replaced.
Information on how to contact Keysight for support, including web resources and office locations.
Explains the structure and location of instrument serial numbers, crucial for service and support.
Guides on the process and considerations for returning an instrument for servicing.
Outlines the chapter's content on troubleshooting common failures during instrument boot-up and initialization.
Describes the step-by-step process of the N9040B Signal Analyzer's boot-up sequence.
Details the typical sequence of events from AC power connection to the analyzer sweep.
Identifies potential hardware issues that might prevent a full instrument boot-up.
Troubleshooting guide for the scenario where the yellow standby LED does not illuminate.
Troubleshooting guide for the scenario where the green power on LED does not illuminate.
Troubleshooting steps for when the instrument's internal fans are not operating.
Troubleshooting steps for when the Keysight splash screen is not displayed during boot-up.
Troubleshooting steps for when the instrument freezes at the Keysight splash screen.
Troubleshooting steps for issues where the operating system fails to load or run.
Steps to troubleshoot a blank internal LCD display, assuming the rest of the instrument functions.
Information on diagnosing issues when initialization processes do not complete successfully.
Guidance on troubleshooting alignment failures using the alignment history screen.
Steps to verify signal levels and troubleshoot problems in the low band path.
Steps to verify signal levels and troubleshoot problems in the high band path.
Outlines the chapter's content on error and status messaging, explaining events, conditions, and categories.
Differentiates between events (occurrences) and conditions (states) in instrument messaging.
Categorizes messages into Errors, Warnings, and Advisories based on severity.
Explains the format of event messages, including numerical order and advisory listings.
Describes the different queues for viewing, querying, and managing event messages.
Provides useful information and status indications; includes gray-out messages for unavailable functions.
Explains how event messages are displayed and categorized using SCPI standards.
Details the event message indicating successful completion of pending operations.
Describes the event message where the instrument requests to become the active IEEE 488 controller.
Details the event message indicating the activation of a user request for local control.
Describes the event message indicating a transition from off to on in the power supply.
Lists and explains various errors related to query commands and instrument responses.
Lists and explains errors specific to the instrument's hardware or software configuration.
Details errors that occur when instrument settings conflict or are not compatible with the current state.
Lists and explains various execution errors that can occur during instrument operation.
Explains condition messages, classified as Errors or Warnings, and their reporting modes.
Details calibration-related errors corresponding to specific status register bits.
Describes errors indicating calibration is needed or has failed, related to specific status registers.
Details errors related to extended calibration needs, corresponding to specific status register bits.
Describes errors indicating extended calibration failures, corresponding to specific status register bits.
Details errors related to measurement integrity, corresponding to specific status register bits.
Lists errors related to signal integrity, corresponding to specific status register bits.
Details errors related to uncalibrated integrity, corresponding to specific status register bits.
Lists errors related to power conditions, corresponding to specific status register bits.
Details errors related to frequency conditions, corresponding to specific status register bits.
Provides summary bits for various condition registers, indicating overall status.
Lists errors related to instrument operation status, corresponding to specific status register bits.
Details errors related to temperature conditions, corresponding to specific status register bits.
Outlines the chapter's content on RF section theory, operation, and troubleshooting.
Describes the RF section's optional frequency ranges and signal paths.
Provides a quick check procedure to verify the low band signal path using the internal 50 MHz calibrator.
Details troubleshooting steps for issues encountered in the low band signal path.
Provides a quick check procedure to verify the high band RF path using the internal 4.8 GHz calibrator.
Details troubleshooting steps for issues encountered in the high band RF path.
Outlines the chapter's content on front end control theory, operation, and troubleshooting.
Describes the purpose, main components, and controlled assemblies of the A15 Front End Controller.
Provides troubleshooting steps for the A15 Front End Control assembly, including use of a troubleshooting board.
Outlines the chapter's content on IF section theory, operation, and troubleshooting for analog and digital IF assemblies.
Describes the A2 Analog IF assembly, its inputs, outputs, and functions.
Explains the theory of operation for the A2 Analog IF assembly, including signal paths and components.
Provides steps to troubleshoot the A2 Analog IF assembly by verifying input and output signals.
Describes the A3 Digital IF assembly, its functions, and inputs.
Explains the theory of operation for the A3 Digital IF assembly, including data acquisition and rear panel triggers.
Provides steps to troubleshoot the A3 Digital IF assembly by verifying input power.
Steps to verify the input power of the 250 MHz IF for Option B40.
Steps to verify the input frequency and amplitude of the 100 MHz reference signal.
Indicates that content for this chapter is coming soon.
Outlines the chapter's content on processor section theory, operation, and troubleshooting.
Describes the A4 CPU assembly, its components, and rear panel connectivity.
Provides troubleshooting steps for the A4 Processor assembly, including boot-up and BIOS settings.
Describes the A5 Disk Drive, its partitioning, and recommended backup procedures.
Details troubleshooting steps for software-related issues with the disk drive.
Addresses issues caused by operating system or instrument application software failures.
Procedure for reloading the instrument application software to resolve boot issues.
Steps to restore the instrument's C: partition using the Instrument Image Recovery System.
Instructions for replacing the instrument's disk drive if other troubleshooting fails.
Outlines the chapter's content on power supply and midplane theory, operation, and troubleshooting.
Describes the purpose and function of the A6 Power Supply assembly.
Provides troubleshooting steps for the A6 Power Supply assembly, including supply voltages and control inputs.
Describes the A7 Midplane board assembly, its functions, and board connections.
Provides troubleshooting steps for the A7 Midplane Board assembly, including checking LEDs and test points.
Indicates that content for this chapter is coming soon.
Lists the hardware options covered in this chapter and where to find more information.
Provides troubleshooting steps for the A21 Wideband Analog IF assembly.
Provides troubleshooting steps for the A22 Wideband Digital IF assembly.
Describes Option RTS, its hardware/software requirements, and functionality check.
Describes the Option H1G assembly, its theory of operation, and related options.
Lists the block diagrams included in this chapter, covering various signal paths and assemblies.
Visual representation of the Analog IF signal path and its components.
Visual representation of the Digital IF signal path and its components.
Introduces the Service and Diagnostics capabilities accessible via system and measure setup menus.
Explains the two levels of service access: regular and secure, and how to gain access.
Details the procedure to access secure service capabilities using a Service Code.
Describes various service keys and their functions, including Timebase, Alignments, and Corrections.
Allows manual adjustment of the 10 MHz reference ("timebase") using the Timebase DAC.
Describes accessing diagnostic capabilities for alignment and invoking subsystem alignments.
Details menu items for controlling alignment behavior and reporting capabilities.
Controls the state of Visible Align, replacing "Aligning 1 or X" messages with descriptive text.
(Not implemented in A.15.xx software) Invokes Notepad to view or save the alignment log.
(Not implemented in A.15.xx software) Describes how the Alignment System logs alignment information.
Allows invoking individual components for internal alignments, such as ADC, LO, IF, and IF Flatness.
Executes LO subsystem alignment, stopping current measurements and restarting after completion.
Executes IF subsystem alignment, stopping current measurements and restarting after completion.
Turns corrections related to IF flatness on or off.
Controls automatic RBW and IQ alignments to avoid hindering troubleshooting.
Controls LO Feedthru nulling, available only in low band.
Controls Intermodulation Nulling, available only in low band.
Allows tuning the analyzer over a large range, checking performance in frequency band overlap regions.
Provides the ability to tune the analyzer over a large range based on the specified LO Band.
Allows locking the Low Noise Path switch, improving sensitivity in high band path.
Provides keys to control the LO, specifically for Option EXM, External Mixing.
Allows testing of the instrument's front panel keys. (Note: Not available in A.15.xx software).
Tests the multi-touch screen functionality with a series of simple tests.
Tests the multi-touch screen functionality with a series of simple tests.
Lists part number tables for assemblies and locations of major assemblies.
Provides part number tables for various instrument components.
Includes diagrams showing the physical locations of major assemblies and parts.
Provides instructions and information for ordering replacement parts, including contact details.
Lists replaceable assemblies, including those related to instrument options.
Lists replaceable parts, including chassis components, brackets, and connectors.
Lists replaceable parts, including chassis components, brackets, and connectors.
Lists various cables used in the instrument, specifying their connections and part numbers.
Lists various cables and connectors, including those for options like RTS and H1G.
Illustrates and lists external hardware components of the instrument.
Identifies and lists the part numbers for the instrument's major assemblies.
Illustrates and lists external hardware components of the instrument.
Lists part numbers for external hardware components like handles and feet.
Details the removal and replacement of the top brace and card cage brace.
Shows the location of RF area components for specific options.
Lists components within the RF area for specific options, including part numbers.
Illustrates and lists RF area cables for specific options.
Illustrates and lists RF area cables for specific options.
Illustrates and lists RF front end cables for specific options, noting B5X differences.
Illustrates and lists RF front end side cables for specific options.
Shows the location of RF area components for specific options.
Lists components within the RF area for specific options, including part numbers.
Illustrates and lists RF area cables for specific options.
Lists part numbers for RF area cables for specific options.
Identifies and lists part numbers for card cage boards like A15, A16, A21, and A14.
Illustrates and lists cables connecting the Reference Assembly and Front End Controller.
Illustrates and lists cables related to the LO Synthesizer assembly.
Identifies and lists part numbers for the A2 Analog IF and A3 Digital IF assemblies.
Illustrates and lists cables associated with the Analog IF assembly.
Shows the CPU assembly and lists its components and part numbers.
Illustrates and lists parts associated with the disk drive tray.
Identifies and lists part numbers for the rear boards of the instrument.
Illustrates Wideband IF ribbon cables.
Lists part numbers for Wideband IF cables.
Describes the Wideband Extension Board for Option RTS, including its bracket and cable assembly.
Identifies the H1G Assembly (Option H1G) and its part number.
Identifies the front, rear, and bottom motherboards and their part numbers.
Illustrates the chassis of the instrument with numbered components.
Lists part numbers for various chassis brackets and components, with serial number dependencies.
Illustrates fan hardware and lists part numbers for fans, screws, and brackets.
Identifies the instrument's input connectors and associated cables.
Identifies front frame components and their part numbers.
Provides an exploded view of the front frame assembly, showing component relationships.
Lists part numbers for front frame components, including knobs, overlays, and boards.
Outlines the chapter's procedures for locating, removing, and replacing major instrument assemblies.
Details the procedure for removing and replacing the instrument's outer case.
Provides removal and replacement procedures for the top brace and card cage brace.
Details removal and replacement steps for components in the RF area for specific options.
Provides removal and replacement procedures for the A9 and A10 RF attenuators.
Details the removal and replacement procedures for the A11 Low Band Switch.
Provides removal and replacement procedures for the A12 YTF Preselector.
Details the removal and replacement procedures for the A20 YTO assembly.
Provides removal procedures for the Low Noise Path and Microwave Preselector Bypass switches.
Details the removal and replacement procedures for the A13 RF Front End Assembly.
Details removal and replacement steps for components in the RF area for specific options.
Provides removal and replacement procedures for the A9 and A10 RF attenuators.
Details the removal and replacement procedures for the A11 Low Band Switch.
Provides removal and replacement procedures for the A12 YTF Preselector.
Details the removal and replacement procedures for the A20 YTO assembly.
Provides removal and replacement procedures for transfer switches SW3 and SW6.
Details the removal and replacement procedures for the A13 RF Front End Assembly.
Details removal and replacement procedures for card cage boards like A15, A16, A21, A14.
Details the removal and replacement procedures for the A15 Front End Control assembly.
Provides removal and replacement procedures for the A16 Reference Assembly.
Provides removal and replacement procedures for the A21 Wideband Analog IF assembly.
Details the removal and replacement procedures for the A14 L.O. Synthesizer.
Details the removal and replacement procedures for the instrument's rear panel.
Provides removal and replacement procedures for the A22 & A23 Wideband Digital IF boards.
Details removal and replacement procedures for the H1G assembly (early version).
Details replacement procedures for the H1G assembly (later version).
Details removal procedures for the Wideband Extension Board (Option RTS).
Details the removal procedures for the A6 Power Supply assembly.
Details the removal and replacement procedures for the A4 CPU assembly.
Describes the removal of the SSD from the CPU assembly.
Details the removal procedures for the A2 AIF/A3 DIF assembly.
Details the removal procedures for the fan assembly and its bracket.
Provides steps for replacing a fan, including reattaching wires and bracket.
Identifies the front, rear, and bottom motherboards and their locations.
Details RF bracket removal for serial numbers below 5605, with variations for Option RTS.
Details RF bracket removal for serial numbers 5605 and above, with variations for Options 544 and 550.
Refers to the Fan Assembly removal procedure.
Details removing the front brace using specific screws.
Refers to the removal procedure for the A11 Low Band Switch.
Details removing the front bracket using specific screws.
Refers to the removal procedure for the Low Noise Path and Microwave Preselector Bypass Switches.
Refers to the removal procedure for the A13 RF Front End Assembly.
Details the removal procedures for the A7 Rear Motherboard.
Details the removal procedures for the A24 Motherboard Interconnect.
Details the removal and replacement procedures for the instrument's input connector.
Details the removal procedures for the front frame assembly.
Identifies front frame components and their part numbers.
Provides an exploded view of the front frame assembly, showing component relationships.
Lists part numbers for front frame components, including knobs, overlays, and boards.
Details the removal and replacement procedures for the front panel shield.
Illustrates and describes the removal and replacement of front panel cables.
Details the removal and replacement procedures for the DC DC converter board.
Details the removal and replacement procedures for the controller bracket and board.
Details the removal procedures for the display assembly.
Details the removal of the RPG knob and separation of the keypad from the keyboard.
Outlines information for returning the instrument to full operation after assembly replacement.
Lists checks and warm-up requirements before starting post-repair procedures.
Refers to Table 1-1 for recommended equipment for performance verification and adjustments.
Lists adjustments and performance tests needed after assembly replacement.
Lists additional tasks such as calibration data backup, BIOS settings verification, and FPGA synchronization.
Guides on backing up and restoring calibration data, especially after replacing the disk drive.
Details the process of verifying BIOS settings after CPU or battery replacement to ensure proper operation.
Describes the initial operating system setup process when a new disk drive is installed.
Displays the Software End User License Agreement for operating system initialization.
Displays an anti-virus message after initialization, indicating readiness for further configuration.
Explains the importance of FPGA code compatibility and the process of updating FPGA code.
Details the utility for updating FPGA code on instrument assemblies to ensure compatibility.
Details the process of verifying BIOS settings after CPU or battery replacement to ensure proper operation.
Describes the initial operating system setup process when a new disk drive is installed.
Explains the process of programming model and serial numbers, crucial after replacing the A7 Midplane board.
Differentiates between functional tests and performance verification tests based on scope and equipment.
Outlines preparation steps before conducting functional tests, including equipment and warm-up.
Summarizes the test equipment needed for functional tests, listing recommended and alternate models.
Describes the procedure and test limits for measuring the Displayed Average Noise Level.
Explains the test limits and procedure for measuring frequency readout accuracy.
Details the test limits and procedure for measuring second harmonic distortion.
Describes the test limits and procedure for measuring amplitude accuracy at 50 MHz.
Details the procedure for testing preamp options, verifying signal level changes and noise floor.
Explains the frequency response test and its test limits, covering amplitude error across frequencies.
Describes the frequency response test when the preamplifier is enabled, including test limits.
Explains the test for checking instrument scale fidelity and the procedure involved.
Lists the topics covered in the chapter, including software overview, licensing, and updates.
Provides an overview of the instrument's software, including measurement applications and licensing.
Explains the requirement for valid licenses for all application software to be available for use.
Details how to obtain and install updates for instrument measurement application software and VSA software.
