Motorola MC68020 - MC68 EC020 Thermal Characteristics and DC Electrical Characteristics

10-4 M68020 USER’S MANUAL MOTOROLA
MC68020 DC Electrical Characteristics
(V
CC
= 5.0 V
dc
± 5%; GND = 0 V
dc
; Temperature within defined ranges)
Characteristics Symbol Min Max Unit
Input High Voltage V
IH
2.0 V
CC
V
Input Low Voltage V
IL
GND
–0.5
0.8 V
Input Leakage Current
GND ≤ V
in
≤ V
CC
BERR, BR , BGACK, CLK, IPL2–IPL0 ,
AVEC ,DSACK1, DSACK0, CDIS
HALT
, RESET
I
in
–1.0
–20
1.0
20
µA
Hi-Z (Off-State) Leakage Current
@ 2.4 V/0.5 V
A31–A0, AS, DBEN, DS, D31–D0, FC2 –
FC0, R/W
, RMC, SIZ1–SIZ0
I
TSI
–20 20
µA
Output High Voltage
I
OH
= 400 µA
A31–A0, AS, BG, D31–D0, DBEN, DS,
R/W,
ECS, IPEND, RMC, SIZ1–SIZ0, FC2–FC0
V
OH
2.4 —
V
Output Low Voltage
I
OL
= 3.2 mA
I
OL
= 5.3 mA
I
OL
= 2.0 mA
I
OL
= 10.7 mA
A31–A0, FC2–FC0, SIZ1–SIZ0, BG, D31–0
AS
, DS , R/W, RMC , DBEN, IPEND,
ECS , OCS
HALT
, RESET
V
OL
—
—
—
—
0.5
0.5
0.5
0.5
V
Power Dissipation (T
A
= 0°C) P
D
— 2.0 W
Capacitance (see Note)
V
in
= 0 V, T
A
= 25˚C, f = 1
MHz
C
in
— 20 pF
Load Capacitance ECS, OCS
All Other
C
L
—
—
50
130
pF
NOTE: Capacitance is periodically sampled rather than 100% tested.
10.2.2 MC68EC020 Thermal Characteristics and DC Electrical
Characteristics
MC68EC020 Thermal Resistance (°C/W)
The following table provides thermal resistance characteristics for junction to ambient and
junction to case for the MC68EC020 packages with natural convection and no heatsink.
Characteristic – Natural Convection and No Heatsink θ
JA
θ
JC
Thermal Resistance
PPGA Package (RP Suffix)
PQFP Package (FG Suffix)
32
53
10
18
MC68EC020 PQFP Package
Table 10-4 provides typical and worst case thermal characteristics for the MC68EC020
PQFP package without a heatsink.
Table 10-4. θ
JA
vs. Airflow—MC68EC020 PQFP Package
Airflow in Linear Feet/Minute
θ
JA
0* 50 100 200 300 400
Maximum—No Heatsink 53 49 45 41 38 36
Typical—No Heatsink 51 47 43 39 37 35