Lenovo ThinkSystem SR650 V3 7D75 - Thermal Rules

• RAID 940 series or 9350 series adapters require a RAID flash power module.
• Mixing of RAID/HBA 4350/5350/9350 adapters (Gen 3) and RAID/HBA 440/540/940 adapters (Gen 4)
in the same system is not allowed.
• RAID/HBA adapters belonged to the same generation (Gen 3 or Gen 4) are allowed to be mixed in the
same system.
• The RAID/HBA 4350/5350/9350 adapters cannot be mixed with the following adapters in the same
system:
– Intel E810-DA2 OCP/PCIe Ethernet adapter
– Intel E810-DA4 OCP/PCIe Ethernet adapter
• The RAID 940-8i or RAID 940-16i adapter supports Tri-mode. When Tri-mode is enabled, the server
supports SAS, SATA and U.3 NVMe drives at the same time. NVMe drives are connected via a PCIe
x1 link to the controller.
Note: To support Tri-mode with U.3 NVMe drives, U.3 x1 mode must be enabled for the selected
drive slots on the backplane through the XCC Web GUI. Otherwise, the U.3 NVMe drives cannot be
detected. For more information, see
“U.3 NVMe drive can be detected in NVMe connection, but
cannot be detected in Tri-mode” on page 479
.
• The virtual RAID on CPU (VROC) key and Tri-mode are not supported at the same time.
Thermal rules
This topic provides thermal rules for the server.
•
“Server models with front drive bays only” on page 69
• “Server models with middle/rear drive bays” on page 71
• “Server models with GPUs” on page 72
Server models with front drive bays only
This section provides thermal information for server models with front drive bays only.
Max.Temp.: Maximum ambient temperature at sea level; S: standard; P: performance
Front drive
bays
Max. Temp.
CPU TDP
(watts)
Heat sink Air baffle Fan type Max.
DIMM
Qty.
note
8 x 2.5"
16 x 2.5"
8 x 3.5"
35°C
<= 250
2U (S) S S
32
35°C 270 <= TDP <=
330
T-shape (P) S P 32
30°C
350
T-shape (P) S
P 32
24 x 2.5"
30°C
<= 205
2U (S) S S
32
30°C
205 < TDP <=
250
2U (S) S
P 32
30°C 270 <= TDP <=
330
T-shape (P) S P 32
25°C
350
T-shape (P) S
P 32
12 x 3.5"
30°C
<= 205
2U (S) S S
32
30°C
205 < TDP <=
250
2U (S) S
P 32
Chapter 5. Hardware replacement procedures 69