Particulate and gaseous contamination specifications
The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous
contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage
or failure, you may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of
the customer.
Table 21. Particulate contamination specifications
Particulate contamination Specifications
Conductive dust Air must be free of conductive dust, zinc whiskers, or other
conductive particles
NOTE: This condition applies to data center and non-data center
environments.
Corrosive dust
● Air must be free of corrosive dust
● Residual dust present in the air must have a deliquescent point less
than 60% relative humidity
NOTE: This condition applies to data center and non-data center
environments.
Table 22. Gaseous contamination specifications
Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver coupon corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013
Thermal restriction matrix
Table 23. Commodities thermal restrictions
Commodities Configuration 2 x NVMe 4 x NVMe
GPUs Intel Max 1550
GPU
Nvidia H100 GPU chassis
Processors 8468 350 W 35° C 35° C
8480+ 350 W N/A 35° C
8470Q 350 W N/A 35° C
8470 350 W N/A 35° C
8460+ 300 W N/A 35° C
8452Y 300 W N/A 35° C
Memory 64 GB RDIMM 4800 MT/s 1 DPC/ 2 DPC 35° C 35° C
BOSS 35° C 35° C
PCIe 35° C 35° C
OCP 35° C 35° C
28 Technical specifications
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