Intel 855GME

202
Intel
®
855GME Chipset and Intel
®
6300ESB ICH Embedded Platform Design Guide
Intel
®
6300ESB Design Guidelines
Figure 101. 6300ESB AC'97 – AC_SDOUT/AC_SYNC Topology
Table 77. AC’97 AC_SDOUT/AC_SYNC Routing Summary
Trace
Impedance
AC’97 Routing
Requirements
Trace Lengths
Series Termination
Resistance
AC_SDOUT/AC_
SYNC Signal
Length Matching
55
Ω ± 10%
5 mil width, 10 mil
spacing (based on
stackup assumptions
in Section 3.1)
L1 =3 to 6 inches
L2 = 3 to 6 inches
L3 = 0.1 to 0.5 inches
L4 = 3 to 6 inches
R1 = 34
Ω - 38 Ω
R2 = R1
N/A
Figure 102. 6300ESB AC'97 – AC_SDIN Topology