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Intel 855GME User Manual

Intel 855GME
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146
Intel
®
855GME Chipset and Intel
®
6300ESB ICH Embedded Platform Design Guide
System Memory Design Guidelines (DDR-SDRAM)
5.4.6.4 Command Group Package Length Table
The package length data in Table 39 shall be used to match the overall length of each command
signal to its associated clock reference length.
5.4.7 CPC Signals – SMA[5,4,2,1], SMAB[5,4,2,1]
The 82855GME control signals, SMA[5,4,2,1] and SMAB[5,4,2,1], are common clocked signals.
They are “clocked” into the DDR SDRAM devices using clock signals SCK[5:0]/SCK[5:0]#. The
GMCH drives the CPC and clock signals together, with the clocks crossing in the valid control
window. The GMCH provides one set of CPC signals per DIMM slot. Refer to Table 40 for the
SMA and SMAB signal to DIMM mapping.
Table 39. Command Group Package Lengths
Signal Pin Number Pkg Length (mils)
SMA[0] AC18 420
SMA[3] AD17 472
SMA[6] AD8 591
SMA[7] AD7 596
SMA[8] AC6 630
SMA[9] AC5 681
SMA[10] AC19 377
SMA[11] AD5 683
SMA[12] AB5 609
SBA[0] AD22 592
SBA[1] AD20 435
SCAS# AC24 562
SRAS# AC21 499
SWE# AD25 751
Table 40. Control Signal to DIMM Mapping
Signal Relative To DIMM Pin
SMA[1] DIMM0 AD14
SMA[2] DIMM0 AD13
SMA[4] DIMM0 AD11
SMA[5] DIMM0 AC13
SMAB[1] DIMM1 AD16
SMAB[2] DIMM1 AC12
SMAB[4] DIMM1 AF11
SMAB[5] DIMM1 AD10

Table of Contents

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Intel 855GME Specifications

General IconGeneral
ManufacturerIntel
Model855GME
TypeChipset
Graphics CoreIntel Extreme Graphics 2
Memory TypeDDR
Maximum Memory Size2 GB
FSB400MHz
Integrated VideoYes
Graphics Base Frequency200 MHz
PCI SupportYes
USB SupportUSB 2.0
ATA SupportATA-100
PackageMicro-FCBGA
Memory TypesDDR 200/266/333 MHz

Summary

3 General Design Considerations

4 Intel® Pentium® M/Celeron® M Processor FSB Design and Power Delivery Guidelines

4.1 Intel® Pentium® M/Celeron® M Processor FSB Design Recommendations

Provides recommendations for meeting timing and voltage specs for optimal operation.

4.4 Intel® Pentium® M/Celeron® M Processor Decoupling Recommendations

Offers guidelines for system board bulk and high-frequency decoupling capacitor solutions.

4.8 Intel 855GME Chipset Platform Power Delivery Guidelines

Provides guidelines for power delivery and decoupling for the Intel 855GME chipset.

5 System Memory Design Guidelines (DDR-SDRAM)

6 Integrated Graphics Display Port

7 AGP Port Design Guidelines

7.2 AGP Routing Guidelines

Provides routing guidelines for AGP 1X and 2X/4X timing domains.

8 Hub Interface

8.1 8-Bit Hub Interface Routing Guidelines.

Covers routing guidelines for 8-bit Hub Interface data and strobe signals.

9 Intel® 6300ESB Design Guidelines

9.6 USB 2.0

Covers layout guidelines for USB 2.0, including trace separation and connections.

9.10 PCI-X Design Guidelines

Provides guidelines for connecting and routing the 6300ESB PCI-X interface.

11 Platform Clock Routing Guidelines

11.2 Clock Group Topologies and Routing Constraints

Defines recommended topologies and rules for platform level clocks.

12 Schematic Checklist Summary

12.3 Intel® 855GME Chipset GMCH (82855GME) Checklist

Checklist for GMCH system memory interface and decoupling.

12.4 Intel® 6300ESB Checklist

Checklists for PCI-X, PCI, Hub, FWH/LPC, GPIO, USB, Power, CPU, System Management, RTC, UART, AC'97, Misc.

13 Layout Checklist

13.2 Intel® 855GME Chipset GMCH Layout Checklist

Layout checklist for GMCH interface signals and memory decoupling.

13.3 Intel® 6300ESB Layout Checklist

Provides layout guidelines for 8-bit Hub Interface, Serial ATA, IDE, USB 2.0, AC'97, RTC, PCI-X, PCI.

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