January 2007 247
Intel
®
855GME Chipset and Intel
®
6300ESB ICH Embedded Platform Design Guide
Miscellaneous Logic
Miscellaneous Logic 10
The 6300ESB requires additional external circuitry to function properly. Some of these
functionalities include meeting timing specifications, buffering signals, and switching between
power wells. This logic may be implemented through the use of the Glue Chip* or discrete logic.
10.1 Glue Chip 4*
To reduce the component count and BOM (Bill of Materials) cost of the 6300ESB platform, Intel
has developed an ASIC component that integrates miscellaneous platform logic into a single chip.
The 6300ESB Glue Chip is designed to integrate some or all of the following functions into a
single device. By integrating much of the required glue logic into a single device, overall board
cost may be reduced.
Features include:
• Dual, strapping, selectable feature sets
• Audio-disable circuit
• Mute audio circuit
• 5 V reference generation
• 5 V standby reference generation
• HD single color LED driver
• IDE reset signal generation/PCIRST# buffers
• PWROK (PWRGD_3V) signal generation
• Power sequencing/BACKFEED_CUT
• Power supply turn on circuitry
• RSMRST# generation
• Voltage translation from DDC to VGA monitor
• HSYNC/VSYNC voltage translation to VGA monitor
• Tri-state buffers for test
• Extra GP logic gates
• Power LED drivers
• Flash FLUSH#/INIT# circuit
More information regarding this component is available from the vendors presented in Table 103.
Table 103. Glue Chip 4 Vendor Information
Vendor Contact Information Vendor Part Number
Philips Semiconductor* http://www.semiconductors.philips.com PCA9504A
Fujitsu Microelectronics* http://www.fujitsumicro.com MB87B302ABPD-G-ER
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