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Intel 855GME User Manual

Intel 855GME
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January 2007 133
Intel
®
855GME Chipset and Intel
®
6300ESB ICH Embedded Platform Design Guide
System Memory Design Guidelines (DDR-SDRAM)
5.4.4.2 SDQS to Clock Length Matching Requirements
The first step in length matching is to determine the SDQS length range based on the SCK/SCK#
reference length defined previously. The total length of the SDQS strobe signals, including package
length, between the GMCH die-pad and the DIMMs must fall within the range defined in the
formulas below. Refer to the clock section for the definition of the clock reference length. Refer to
Table 32 for the definition of the various trace segments.
Length range formula for DIMM0:
X
0
= SCK[2:0]/SCK[2:0]# total reference length, including package length. Refer to Section 5.4.1
for more information.
Y
0
= SDQS[7:0] total length = GMCH package + L1 + L2, as shown in Figure 66, where:
(X
0
– 1.5”) Y
0
(X
0
- 0.5”)
Length range formula for DIMM1:
X
1
= SCK[5:3]/SCK[5:3]# total reference length, including package length. Refer to Section 5.4.1
for more information.
Y
1
= SDQS[7:0] total length = GMCH package + L1 + L2 + L3, as shown in Figure 66 where:
(X
1
– 1.5”) Y
1
(X
1
- 0.5”)
Length matching is only performed from the GMCH to the DIMMs, and does not involve the
length of L4, which may vary over its entire range. Intel recommends that routing segment length
L3 between DIMM0 to DIMM1 be held fairly constant and equal to the offset between clock
reference lengths X0 and X1. This produces the most straightforward length-matching scenario.
Note: A nominal SDQS package length of 700 mils may be used to estimate byte lane lengths prior to
performing package length compensation.

Table of Contents

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Intel 855GME Specifications

General IconGeneral
ManufacturerIntel
Model855GME
TypeChipset
Graphics CoreIntel Extreme Graphics 2
Memory TypeDDR
Maximum Memory Size2 GB
FSB400MHz
Integrated VideoYes
Graphics Base Frequency200 MHz
PCI SupportYes
USB SupportUSB 2.0
ATA SupportATA-100
PackageMicro-FCBGA
Memory TypesDDR 200/266/333 MHz

Summary

3 General Design Considerations

4 Intel® Pentium® M/Celeron® M Processor FSB Design and Power Delivery Guidelines

4.1 Intel® Pentium® M/Celeron® M Processor FSB Design Recommendations

Provides recommendations for meeting timing and voltage specs for optimal operation.

4.4 Intel® Pentium® M/Celeron® M Processor Decoupling Recommendations

Offers guidelines for system board bulk and high-frequency decoupling capacitor solutions.

4.8 Intel 855GME Chipset Platform Power Delivery Guidelines

Provides guidelines for power delivery and decoupling for the Intel 855GME chipset.

5 System Memory Design Guidelines (DDR-SDRAM)

6 Integrated Graphics Display Port

7 AGP Port Design Guidelines

7.2 AGP Routing Guidelines

Provides routing guidelines for AGP 1X and 2X/4X timing domains.

8 Hub Interface

8.1 8-Bit Hub Interface Routing Guidelines.

Covers routing guidelines for 8-bit Hub Interface data and strobe signals.

9 Intel® 6300ESB Design Guidelines

9.6 USB 2.0

Covers layout guidelines for USB 2.0, including trace separation and connections.

9.10 PCI-X Design Guidelines

Provides guidelines for connecting and routing the 6300ESB PCI-X interface.

11 Platform Clock Routing Guidelines

11.2 Clock Group Topologies and Routing Constraints

Defines recommended topologies and rules for platform level clocks.

12 Schematic Checklist Summary

12.3 Intel® 855GME Chipset GMCH (82855GME) Checklist

Checklist for GMCH system memory interface and decoupling.

12.4 Intel® 6300ESB Checklist

Checklists for PCI-X, PCI, Hub, FWH/LPC, GPIO, USB, Power, CPU, System Management, RTC, UART, AC'97, Misc.

13 Layout Checklist

13.2 Intel® 855GME Chipset GMCH Layout Checklist

Layout checklist for GMCH interface signals and memory decoupling.

13.3 Intel® 6300ESB Layout Checklist

Provides layout guidelines for 8-bit Hub Interface, Serial ATA, IDE, USB 2.0, AC'97, RTC, PCI-X, PCI.

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